Used ALLIED HIGH TECH PRODUCTS 10-2000 #9227967 for sale

ALLIED HIGH TECH PRODUCTS 10-2000 Wafer Grinding, Lapping & Polishing Equipment is designed for use in a variety of applications requiring precision grinding, lapping, and polishing of wafers. The system utilizes a motorized rotary table, which allows for the use of different abrasive materials on the table to grind, lap, and polish the part. The rotary table and adjustable diamond-jigs allow the user to precisely set the angle, depth, and cutting pattern for each wafer. The unit also provides a complete grinding/polishing process, with adjustment and control of parameters such as overall grinding and polishing speed, table speed, jig angle, and grit size. The rotary table and diamond jigs are also adjustable for the degree of tilt needed for lap application. 10-2000 Wafer Grinding, Lapping & Polishing Machine is built to handle volumes of production. The variable speed control allows for the highest degree of accuracy in precision grinding and polishing while providing a rugged and reliable operation. Additional features include a safety-protected glass shielding for safety and improved viewing, a removable vapor shield that covers the front side of the unit to reduce overspray of particulate matter, and dust extraction ports to keep the environment clean. The tool also comes equipped with a full set of wafer holders and jigs, as well as a polishing set and cooling fans. ALLIED HIGH TECH PRODUCTS 10-2000 Grinding, Lapping & Polishing Asset is an advanced and reliable processing model capable of providing precise, high-quality results on a consistent basis. This equipment is ideal for applications such as semiconductor wafer fabrication, electroplating, wafer thinning, substrate fabrication, and various surface engineering tasks. With the many features and options offered, this system is a great choice for a wide range of grinding, lapping, and polishing applications.