Used ALLIED Multiprep 200 #293646109 for sale

ALLIED Multiprep 200 is an advanced wafer grinding, lapping, and polishing equipment. This system is designed to enable precise polishing and grinding of wafer substrates in a variety of applications, such as optical semiconductor manufacturing. The unit is automated, and features a highly accurate grinding head positioning and a precision-molded grinding disc. The grinding head can move in three axes - X, Y, and Z - to ensure precision accuracy. The grinding head is also capable of a range of speeds, making Multiprep 200 an ideal choice for high-precision polishing and grinding applications. ALLIED Multiprep 200 also features an automated wafer transfer and lapping machine. This tool ensures that the wafer is positioned correctly in the grinding/polishing area. It ensures that the wafer is placed flat on the surface, and that it is securely held in place while the process is underway. Multiprep 200 is a highly efficient asset, allowing for faster and smoother operation. This results in improved throughput, as well as enhanced product quality and efficiency. ALLIED Multiprep 200 is equipped with a high-capacity vacuum model. This feature ensures that particles and powder created during the grinding/polishing process are properly removed. The equipment also features an integrated dust extraction and a containment system to ensure that the area remains clean and dust-free. Overall, Multiprep 200 is an advanced and highly capable wafer grinding, lapping, and polishing unit. Its automated features, combined with its precision accuracy and dust extraction capabilities, make it an ideal choice for businesses that require precise and repeatable polishing and grinding operations.