Used ALLIED Multiprep #293821420 for sale

ID: 293821420
Wafer Size: 8"
Polisher, 8".
ALLIED Multiprep is a multi-functional grinding, lapping, and polishing equipment specifically designed for wafer processing applications. The versatile system is capable of performing multiple operations on complex devices with ultra-precision accuracy, such as pre- and post- bond grinding, sputter cleaning, integrated metrology and yield analysis, lapping, polishing, and more. Multiprep unit consists of a central base unit, a polishing head and several tooling assemblies, such as a grinding wheel fixture, lapping plates, and a polishing head. The base of the unit has a controller, blower, and water chiller integrated into the design, delivering precision cooling and precise control of fluid temperatures, cooling rates, and oxygen levels. It also provides a wafer platen that automatically maximizes part loading by restricting the motion of the wafer, allowing for accurate grinding and polishing results. An integrated vacuum machine is also included to ensure no offsetting or artifacts are caused by the workpiece. The tool supports multiple substrates, including silicon, gallium arsenide, germanium, and barium strontium titanate. The grinding wheel fixture is designed with adjustable diamond pins that provide precise control for wafer slicing and lapping operations. The lapping plates are mounted on the air bearing slide for precise part clamping and alignment during lapping. Additionally, the polishing head includes adjustable polishing pads and a unique suspension technology to prevent chatter and ensure consistent results. ALLIED Multiprep provides an ergonomic, compact design for simple operation. The unique design also allows for remote monitoring and control of the asset through an advanced Ethernet interface. It also supports multiple user levels, giving the user control over who can access various functions. Additionally, the model provides environmental protection for process materials by eliminating airborne pollutants and preventing spillage with a sealed enclosure. And by utilizing a state-of-the-art filtration equipment, dust particles and other contaminants are extracted away from the operator and the work environment. Overall, Multiprep combines precise accuracy with increased efficiency, providing a reliable and trusted solution to wafer grinding, lapping, and polishing needs.
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