Used ALLIED TechCut 5 #293770863 for sale

ALLIED TechCut 5 is a high-performance wafer grinding, lapping and polishing system designed to yield highly-accurate wafers with outstanding surface quality for use in the semiconductor industry. It is capable of machining wafers with a top surface area up to 5.5 inches in diameter, has a high degree of friction control, and utilizes a single-axis, X-Y configuration. The grinding head uses a digital servo motor to drive a variable speed polishing process, with a maximum speed of 2000 RPM and a speed control accuracy of 0.5%. The head can be positioned quickly with a manual crank, and has a 0.1 µm accuracy level repeatability. It is also equipped with a dust collection system for efficient removal of grinding debris and other debris from the workspace. The lapping module is equipped with two sets of high-performance hydrostatic guides that enable precise adjustment of lapping pressure. The pressure is also adjustable, giving the user the flexibility to adjust the lapping process to the type of wafer being processed. The lapping head also houses an Allen-Bradley digital servo motor that drives a large 50-100mm diameter wet polishing plate. The polishing module is equipped with a precision-grade polishing head with an accuracy of 0.2 µm and repeatability of 0.01 µm. It houses an independent controller that allows for synchronous operation of the abrasive head and the platform for fast and precise polishing processes. The digital servo motor further enables variable speed control up to a maximum of 500 RPM. TechCut 5 wafer grinding, lapping and polishing system uses a number of features to ensure the highest-quality results, including precise speed and pressure control, highly reliable grinding/lapping/polishing heads, and excellent dust removal functions. Its robust design makes it durable, and its excellent performance enables it to quickly process even the most intricate wafers.