Used ALLIED TechCut 5 #9227451 for sale

ALLIED TechCut 5
ID: 9227451
Sectioning machine M/N: 5-5300-230.
ALLIED TechCut 5 is a highly advanced wafer grinding, lapping, and polishing equipment made in the USA. Described as a fully automated process, ALLIED CUT 5 is highly regarded for its ability to allow for streamlined process control. The system consists of a digital controller, a multi-axis robot, and the grinding and polishing heads. The controller allows you to set grinding and polishing parameters as well as monitor progress during the process. The multi-axis robot allows for precise positioning of the grinding and polishing head, as well as automated changing and loading of new wafers. The grinding and polishing head consists of a rotating diamond impregnated coating on the end of a four-prong tool. It is capable of grinding, lapping, and polishing wafers up to 10 inches in size. TechCut 5 offers a variety of features including programmable process parameters and speeds, automated setup, multiple grinding and polishing cycles, and advanced diagnostics. This unit also offers custom linishing options for grinding and polishing applications that require specific patterns or angles. CUT 5 is capable of removing surface defects, scratches, and other contamination from the wafer surfaces in order to achieve the highest possible quality and yields. This machine is also able to produce extremely smooth surfaces that enable better product performance and improved yield. ALLIED TechCut 5 is designed to run in a dust-free environment and is noted for its low noise and vibration levels. This ensures a clean working environment and a high level of safety for those handling and operating the tool. In addition to its wafer grinding and polishing capabilities, ALLIED CUT 5 offers the ability to profile the thickness of dielectric layers as well as inspect topography via an automated profiling head. With its integrated software, TechCut 5 is able to achieve high accuracy and repeatability rates. Overall, CUT 5 provides an efficient and reliable asset for wafer grinding, lapping, and polishing, allowing for accurate and repeatable results in a clean, dust-free environment.
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