Used ALLIED TechPrep 8 #165279 for sale

ALLIED TechPrep 8 is a customizable, high-precision wafer grinding, lapping, and polishing equipment designed for repeatable and reliable performance throughout the lifetime of the process. The system features a compact and rigid design that ensures minimal vibrations, a wide operating window, and low operating temperature. The grinding, lapping, and polishing heads can be seamlessly and quickly swapped for process flexibility, allowing for continuous quality improvement. This unit also incorporates a variety of advanced process and metrology technologies, including pulsed laser diffraction, optical microscopy, and CCD cameras. The machine works by deploying lapping and polishing solutions to either side of the wafer to reduce abrasions. The solutions range from granular liquids, slurry materials, diamond suspensions, and pastes. The lapping and polishing heads have an adjustable angle of attack and motion controlled to keep the working surface of the solution in constant contact with the wafer to provide consistent and repeatable results. The tool also provides excellent surface uniformity and yield due to its low operating temperature, which prevents thermal shock damage. TechPrep 8 also features a one-step process that is flexible and easy to use. This process optimizes both production costs and delivery times by eliminating the need for multiple tool changes. It also reduces setup times, thanks to its integrated centering and chucking systems, and provides parameters that can be easily tweaked to obtain the desired output. The asset is also highly automated, featuring auto-leveling capability, automatic emptying features, and smart operation control to minimize personnel intervention. It also features built-in safety features such as emergency stop buttons, guards, and light curtains. The model also has sophisticated diagnostic functions to easily identify problems and maximize equipment uptimes. Overall, ALLIED TechPrep 8 is a high-precision, automated, flexible, and dependable drug product manufacturing system, with particular benefits in the grinding, lapping, and polishing needs of the pharmaceutical and semiconductor industries. The unit provides superior performance and consistency while minimizing labor costs, improving efficiency, and ensuring quality throughout the process life.