Used ALPHA ADG-400 (6B) #9294722 for sale

ALPHA ADG-400 (6B) is a combined wafer grinding, lapping, and polishing equipment made by a manufacturer of semiconductor fabrication equipment. This system is designed to produce high-quality epitaxial layers on silicon substrates. The ADG-400 includes a grinding wheel driven by a spindle motor, and a lapping platen driven by an independent motor. The grinding wheel is made of P220 abrasive, and the lapping platen contains a diamond abrasive paste. This machine also includes both coarse and fine grinding systems. The unit features a fully automated grinding and lapping operation capable of exerting a force between 15 and 360 pounds. In addition, it can provide surface finishes of up to 8 microns. This grinding machine makes use of a CNC-controlled grinding arm and is able to process the wafer between 0.7 and 8 mm thick. The ADG-400 has a built-in vacuum tool for controlling grinding debris. Also included is a polishing pad-controlled asset with an adjustable speed for improved polishing efficiency. This model has variable pressure sensitivity so that parts won't be over-polished. The equipment uses digital temperature controllers to monitor the temperature in order to protect the integrity of the part being processed. Other features of this system include a tool wear monitoring unit, a motor overload detection, and a dust collection machine. ALPHA ADG-400 (6B) is a powerful and dependable tool that helps to produce superior wafer substrates for semiconductor fabrication. This asset offers fast, precise, and consistent grinding, lapping, and polishing performance. Its advanced features make it ideal for high-volume manufacturing of high-quality epitaxial layers on silicon substrates.