Used ALPSITEC MECAPOL E550 #9240664 for sale
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ID: 9240664
Wafer Size: 6"
CMP System, 6"
Rack:
Wafer diameter: < 200 mm
Rotation speed: 15-150 RPM
Rear pressure: 0-100 kPa
Polishing force: 0-3000 N (14 psi on 8")
Horizontal displacement: Adjustable amplitude
Main load tray:
Diameter: 550 mm
Rotation speed: 15-150 RPM
Temperature: 10°C - 60°C
Secondary tray:
Diameter: 350 mm
Rotation speed: 20-200 RPM
Conditioner:
Force: 10-300 N
Diameter: 100mm, 238 mm
Rotation speed: 10-70 RPM
Final conditioner:
Linear brush: 22 mm x 100 mm
Facilities:
Pressurized air: 6-7 bars
Head motor: 0.75 kW
Engine tray: 2.2 kW
Conditioner engine: 0.37 kW
Consumption:
Water-DI: 200 L/hr
Pressurized air: 220 L/min
Electricity: 5 kW
Air gap: Internal pump
Power: 220-380 V, 50-60 Hz, 3 Phase.
ALPSITEC MECAPOL E550 is an advanced wafer grinding, lapping and polishing equipment designed to produce high quality, high yield wafers with superior surface finish. The system features a patented "self-aligning" vertical grinding principle and is designed to process large wafers up to 250mm with a 0.5μm roughness average (RA) and up to 10μm surface flatness. MECAPOL E550 offers a range of highly efficient silicon grinding and lapping technology with three independent grinding spindles, allowing for high-precision and repeatable grinding results. ALPSITEC MECAPOL E550 is equipped with a monitoring unit to ensure efficient and safe operation. The machine is designed for batch or fully automated processing and is capable of automated wafer loading and unloading. The tool is also fitted with two-dimensional auto-focus cameras which enable accurate measurement and adjustment of grinding parameters. Additionally, the E550 is compatible with all popular high speed systems, allowing for seamless integration into existing production processes. MECAPOL E550 can also be equipped with a digital LCD touch screen for easy setup and adjustment of machine parameters and recipe loading. The asset also features a built-in part counter and throttle sensors to monitor grinding time and output of each batch. A high-precision vibration isolation model is fitted to minimize the possibility of errors caused by excessive vibrations and disturbances. ALPSITEC MECAPOL E550 provides high quality, high yield wafers with excellent surface finish. Featuring advanced grinding, lapping and polishing technologies, the equipment can process large wafers up to 250mm with a 0.5μm RA and up to 10μm surface flatness. The system is also fitted with fail-safe monitoring systems and user-friendly LCD touchscreen controls, allowing for easy operation and setup. With its efficient production rate and reliable, repeatable results, MECAPOL E550 is an ideal solution for grinding, lapping and polishing large wafers.
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