Used AMADA SE-52N1 #9395041 for sale

AMADA SE-52N1 is a wafer grinding, lapping, and polishing equipment designed to perform thin wafer grinding, lapping, and polishing operations on a variety of materials from semiconductor die to optical glasses. The system includes two independent grinding spindles, both of which are mounted on the same base to achieve precise XY-axis positional accuracy. The spindle assemblies are driven by AC servomotors and driven spindles that can support a maximum speed up to 50,000 RPM. The secondary spindle is tilt able up to 20° allowing for a precise grinding/polishing surface to be achieved. The wafer is held in a precise alignment to the grinding spindles by means of vacuum, with a chucking pressure of up to 60KPa. The servomotors control the precise motion of the spindles during the grinding, lapping, and polishing process, while grinding wheels and lapping film are used in the grinding and lapping stages, respectively. The precision grinding/polishing process is performed in a chamber equipped with a vacuum sealed base and filter to ensure clean operation and ensure that no pollutants are drawn into the chamber while being processed. The automatic feeder is controlled by a computerized controller, allowing the unit to edge grind, radial grind, and grooving quickly and accurately. The machine is also equipped with an automatic belt tensioner to ensure that the abrasive belt is always at the optimal tension for optimal grinding performance. The wafer orientation tool offers repeatable thin wafer grinding, lapping, and polishing results. The asset is also capable of polishing various substrates including metals, insulators, plastics, and composites. Overall, SE-52N1 is a highly advanced wafer grinding, lapping, and polishing model and is capable of grinding, lapping, and polishing thin wafers of multiple materials with extreme precision. The equipment offers a high degree of accuracy, repeatability, and the ability to quickly process wafers, thus delivering superior performance and production throughput.