Used AMADA SG-45FII #9395047 for sale

AMADA SG-45FII Wafer Grinding, Lapping and Polishing Equipment is an advanced, automated, large-scale grinding, lapping and polishing machine for producing ultra-precise wafers in high volume and with the highest quality standards. Designed for use in the semiconductor industry, this system is capable of performing the entire sequence of grinding, lapping and polishing activities in a single, complete unit. SG-45FII is equipped with an advanced CNC machine for precise control and smooth operation. This tool can be easily customized to accommodate specific process and production needs. It features a large working envelope to accommodate up to 56.5" wafer diameters. The asset is equipped with an automated wafer transport model and is configured to accurately monitor and maintain multiple grinding and polishing processes in sequence. AMADA SG-45FII is versatile and can be used to grind, lap, and polish both sapphire and silicon wafers. Its unique capability for simultaneous workpiece exposure offers the capability to produce lapping and polishing work pieces with excellent surface finish and tight tolerances. This equipment also features a highly integrated software control interface for efficient operation and enhanced process control. In order to meet various needs, the system is available in various configurations, such as with a saw, grinding/polishing head, and robotic handling. SG-45FII Wafer Grinding, Lapping and Polishing Unit offers a unique combination of features that make it a reliable and versatile wafer grinding solution. Its highly reliable, durable, and accurate design ensures excellent quality wafers every time. The machine is capable of quickly and precisely processing wafers of different sizes and substrates, while its flexibility allows it to accommodate various wafer-thickness levels. AMADA SG-45FII's advanced technology enables superior production efficiency, cost-effectiveness, flexibility, and scalability.