Used AMAT / APPLIED MATERIALS Mirra Mesa #9203803 for sale

AMAT / APPLIED MATERIALS / AKT Mirra Mesa is a multi-task wafer grinding, lapping & polishing equipment designed to grind, lap and polish semiconductor wafers for the fabrication of advanced electronic and optoelectronic devices. It combines in-line, single-side grinding, lapping and polishing for a wide variety of semiconductor materials into a single machine, making it an ideal solution for post-fabrication process requirements. AKT Mirra Mesa system incorporates a four-axis motion platform with high precision spindle drive motors and encoders, designed to provide high speed and precise alignment for grinding, lapping and polishing operations. The grinding capabilities range from 0.1 micron to a few hundreds of nanometers, while its lapping and polishing capabilities range from 1 micron down to just a few nanometers. The unit is able to achieve a uniform wafer thickness over the entire area, thereby supporting the highest yield for wafer fabs. The machine's patented air bearing technologies provide an exceptionally stable platform and work surface for critical wafer grinding and polishing. It is also designed with a user-friendly control tool that allows operators to set and adjust parameters for precision grinding, lapping and polishing processes. Additionally, the asset features a modern and versatile programmable logic controller (PLC) allowing users to automatically manage and control the various steps of the process. In terms of processing quality, the model's state-of-the-art technologies ensure accuracy and repeatability of the grinding, lapping and polishing process, as well as robust results regarding film stress, stress uniformity and critical dimension (CD) uniformity. Furthermore, the equipment has the ability to meet a wide range of end-user requirements as it supports various materials, from standard to exotic grades. In conclusion, AMAT Mirra Mesa wafer grinding, lapping and polishing system enables fabs to integrate single-side wafer grinding, lapping and polishing into their processes, thereby supplying them with an exceptionally versatile and reliable machine capable of achieving high yields, uniform wafer thicknesses, precise lapping and polishing accuracies, and robust process results.