Used AMAT / APPLIED MATERIALS CMP 3600 #9160608 for sale
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ID: 9160608
Wafer Size: 12"
Vintage: 2002
Reflexion system, 12"
General features:
(4) Titan heads
(3) Platen systems
Operator interface with monitor and keyboard
Windows NT based software control
Integrated electronics control cabinet
Integrated applied materials factory interface on four-wide frame
Integrated mesa cleaner including two brush scrubber modules
Spin rinse dry module
CD ROM
Wafer type: Notch P/N 36-0103
Reflexion polisher type:
Reflexion CMP poly system: P/N 36-0004
Software use license: P/N 36-1001E
CMP System:
Consumed process materials:
Politex pads: P/N 36-1022
(2) IC1000 pads: P/N 36-1020
Metrology:
Digital in situ removal monitor (ISRM) on cach platen
Full scan ISRM on 3 Platens: P/N 36-5153
System regulation compliance: P/N 36-9801
Polisher options:
Platen and head options:
Clear windows on skins for polisher: P/N 36-5732
(4) UPA zones
Profiler UPA: P/N 36-2039
Wafer loss sensor for dark pads: P/N 36-7939
With 50' cable
Neslab S2HCFC-Free HX300: P/N
AMAT Supplied platen temperature control
Facilities options:
System safety equipment
31” cleaner workspace: P/N 36-0115
Electrical requirements
200-230VAC 50/60Hz, input voltage: P/N 36-0119
Factory hookup:
Cleaner drain manifold - 2 lines (1 slurry, 1 reclaim): P/N 36-0121
Operator interface options:
User interface:
4 Color light tower, front of FI: P/N 36-0124
Vertical flush mounted
RYGB
LED lamp
Cleaner for CMP reflexion system
Module 1 (Megasonics):
Megasonics: P/N 36-0502
Pressurized LDM: P/N 36-0503
Supports chemicals:
A: High dilution 29% NH4OH B: 30% Hydrogen peroxide (H202)
A: High dilution 29% NH40H B: 0.5% NCW-601A surfactant
Module 2 & 3 (Brush scrubber modules):
Brush scrubber modules
(2) RIPPEY microclean brush: P/N 36-1679
(2) Direct feed LDM: P/N 36-0514
Supports the following chemicals;
0.05% -0.1% Ammonium hydroxide (NH40H)
0.5%-l% Hydrogen fluoride (HF)
200:1 Electroclean
Pre-mixed SC-1
Pre-mixed proprietary chemical
Module 4 (Spin rinse dry):
Rinse with lamp dry: P/N 36-0519
Factory interface options:
Integrated applied materials factory interface with
25-Wafer FQUP load ports
Upper E84 Sensors and cables
(2) Operator access switch: P/N 36-0260
Boron-free ULPA filter: P/N 36-0270
Four-wide factory interface frame with two load
Ports: P/N 36-0350
Load Ports in positions 1 and 3.
(2) E99 Carrier ID, keyence (BCR FOUP ID reader): P/N 36-0258
Additional options:
System manuals:
CD ROM manual set: P/N 36-0128
Cleanroom reflexion manual set: P/N 36-0130
(English) printed on cleanroom paper
Additional items:
Generic monthly consumables kit: P/N 36-78300
Includes:
(16) O-ring
(2) Filters
(3) DDF3 Diaphragm
Pad conditioner head assembly: P/N 36-7550
Set up / maintenance options:
Polisher to cleaner alignment fixture: P/N 36-8211
Alignment and leveling tool kit (FI – Datum Gauge): P/N 36-0142
Factory interface service lift: P/N 36-0245
One year PM kit: P/N 36-8979
Walking beam alignment tool: P/N 36-2535
Wet robot calibration tool: P/N 36-6141
Spares:
(10) Brush disk: P/N 0020-78263
ECO 10424 - REV1P
Kit, option 3 slurries AB-AB-AC: P/N 0240-15146
Configuration:
Kit, option brush and adapter for pad: P/N 0240-16013
Conditioner, reflexion
Option kit, user interface, flat panel, Wall mounted for TTW reflexion: P/N 0240-06004
(4) 300mm Titan heads: P/N 36-5675
Retaining ring: Grooved PL PPS
Membrane support plate: 0.5 inch, 0mm Edge bump, WAS
Support pad: 0.5 inch Perf holes
Edge control ring: 11.434 inch OD
Upper ASM: A-2-50
Membrane: Neoprene
Dry nova 3030: TEMPNSR-03
300MM Titan head with grooved: TEMPNSR-04
Retaining ring
CE Marked
2002 vintage.
AMAT / APPLIED MATERIALS CMP 3600 is a wafer grinding, lapping, and polishing equipment designed for automated, high-precision grinding and finishing of internal alignment structures across a wide range of wafer types and sizes. It is capable of polishing wafer surfaces to nanometer level accuracy and high surface quality, ensuring that the wafer corrects any geometric alignment errors across a wide range of process conditions. AMAT CMP 3600 is equipped with a 15 in. grinding/polishing platen, a 4 in. in-situ metrology system, a 25 G force LPU, and a dual-zone lapping plate assembly. The LPU is designed to prevent the formation of micro-cracks by applying an accurate, controlled force over the entire wafer surface during grinding and polishing. The in-situ metrology unit allows for real-time monitoring of wafer characteristics during grinding and polishing, reducing the risk of distortions and ensuring a high-quality end-result. APPLIED MATERIALS CMP 3600 is manufactured from robust materials and designed to run continuously for long periods of time without any significant maintenance requirements. The machine is also equipped with automated wafer inspection and electro-chemical surface cleansing capabilities to ensure consistently high quality results. Control of CMP 3600 is handled via an advanced desktop PC and Windows-based GUI, which makes operating the tool simple and efficient. It is also conveniently equipped with LAN and MODBUS network interfaces for remote operation or multiple asset integration. AMAT / APPLIED MATERIALS CMP 3600 employs a diamond-based grinding and polishing slurry to produce high-quality surfaces on a wide variety of wafer types and sizes. The model comprises of ultra-precision slides, dual-zone lapping plate assemblies, and integrated process control hardware to provide maximum flexibility and accuracy. AMAT CMP 3600 is ideal for a variety of wafer fabrication processes, including etching, stripping, and patterning applications. It enables the fabrication of complex structures with nano-level accuracy, ensuring tight tolerances and high process yields.
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