Used AMAT / APPLIED MATERIALS CMP 3600 #9160608 for sale

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ID: 9160608
Wafer Size: 12"
Vintage: 2002
Reflexion system, 12" General features: (4) Titan heads (3) Platen systems Operator interface with monitor and keyboard Windows NT based software control Integrated electronics control cabinet Integrated applied materials factory interface on four-wide frame Integrated mesa cleaner including two brush scrubber modules Spin rinse dry module CD ROM Wafer type: Notch P/N 36-0103 Reflexion polisher type: Reflexion CMP poly system: P/N 36-0004 Software use license: P/N 36-1001E CMP System: Consumed process materials: Politex pads: P/N 36-1022 (2) IC1000 pads: P/N 36-1020 Metrology: Digital in situ removal monitor (ISRM) on cach platen Full scan ISRM on 3 Platens: P/N 36-5153 System regulation compliance: P/N 36-9801 Polisher options: Platen and head options: Clear windows on skins for polisher: P/N 36-5732 (4) UPA zones Profiler UPA: P/N 36-2039 Wafer loss sensor for dark pads: P/N 36-7939 With 50' cable Neslab S2HCFC-Free HX300: P/N AMAT Supplied platen temperature control Facilities options: System safety equipment 31” cleaner workspace: P/N 36-0115 Electrical requirements 200-230VAC 50/60Hz, input voltage: P/N 36-0119 Factory hookup: Cleaner drain manifold - 2 lines (1 slurry, 1 reclaim): P/N 36-0121 Operator interface options: User interface: 4 Color light tower, front of FI: P/N 36-0124 Vertical flush mounted RYGB LED lamp Cleaner for CMP reflexion system Module 1 (Megasonics): Megasonics: P/N 36-0502 Pressurized LDM: P/N 36-0503 Supports chemicals: A: High dilution 29% NH4OH B: 30% Hydrogen peroxide (H202) A: High dilution 29% NH40H B: 0.5% NCW-601A surfactant Module 2 & 3 (Brush scrubber modules): Brush scrubber modules (2) RIPPEY microclean brush: P/N 36-1679 (2) Direct feed LDM: P/N 36-0514 Supports the following chemicals; 0.05% -0.1% Ammonium hydroxide (NH40H) 0.5%-l% Hydrogen fluoride (HF) 200:1 Electroclean Pre-mixed SC-1 Pre-mixed proprietary chemical Module 4 (Spin rinse dry): Rinse with lamp dry: P/N 36-0519 Factory interface options: Integrated applied materials factory interface with 25-Wafer FQUP load ports Upper E84 Sensors and cables (2) Operator access switch: P/N 36-0260 Boron-free ULPA filter: P/N 36-0270 Four-wide factory interface frame with two load Ports: P/N 36-0350 Load Ports in positions 1 and 3. (2) E99 Carrier ID, keyence (BCR FOUP ID reader): P/N 36-0258 Additional options: System manuals: CD ROM manual set: P/N 36-0128 Cleanroom reflexion manual set: P/N 36-0130 (English) printed on cleanroom paper Additional items: Generic monthly consumables kit: P/N 36-78300 Includes: (16) O-ring (2) Filters (3) DDF3 Diaphragm Pad conditioner head assembly: P/N 36-7550 Set up / maintenance options: Polisher to cleaner alignment fixture: P/N 36-8211 Alignment and leveling tool kit (FI – Datum Gauge): P/N 36-0142 Factory interface service lift: P/N 36-0245 One year PM kit: P/N 36-8979 Walking beam alignment tool: P/N 36-2535 Wet robot calibration tool: P/N 36-6141 Spares: (10) Brush disk: P/N 0020-78263 ECO 10424 - REV1P Kit, option 3 slurries AB-AB-AC: P/N 0240-15146 Configuration: Kit, option brush and adapter for pad: P/N 0240-16013 Conditioner, reflexion Option kit, user interface, flat panel, Wall mounted for TTW reflexion: P/N 0240-06004 (4) 300mm Titan heads: P/N 36-5675 Retaining ring: Grooved PL PPS Membrane support plate: 0.5 inch, 0mm Edge bump, WAS Support pad: 0.5 inch Perf holes Edge control ring: 11.434 inch OD Upper ASM: A-2-50 Membrane: Neoprene Dry nova 3030: TEMPNSR-03 300MM Titan head with grooved: TEMPNSR-04 Retaining ring CE Marked 2002 vintage.
AMAT / APPLIED MATERIALS CMP 3600 is a wafer grinding, lapping, and polishing equipment designed for automated, high-precision grinding and finishing of internal alignment structures across a wide range of wafer types and sizes. It is capable of polishing wafer surfaces to nanometer level accuracy and high surface quality, ensuring that the wafer corrects any geometric alignment errors across a wide range of process conditions. AMAT CMP 3600 is equipped with a 15 in. grinding/polishing platen, a 4 in. in-situ metrology system, a 25 G force LPU, and a dual-zone lapping plate assembly. The LPU is designed to prevent the formation of micro-cracks by applying an accurate, controlled force over the entire wafer surface during grinding and polishing. The in-situ metrology unit allows for real-time monitoring of wafer characteristics during grinding and polishing, reducing the risk of distortions and ensuring a high-quality end-result. APPLIED MATERIALS CMP 3600 is manufactured from robust materials and designed to run continuously for long periods of time without any significant maintenance requirements. The machine is also equipped with automated wafer inspection and electro-chemical surface cleansing capabilities to ensure consistently high quality results. Control of CMP 3600 is handled via an advanced desktop PC and Windows-based GUI, which makes operating the tool simple and efficient. It is also conveniently equipped with LAN and MODBUS network interfaces for remote operation or multiple asset integration. AMAT / APPLIED MATERIALS CMP 3600 employs a diamond-based grinding and polishing slurry to produce high-quality surfaces on a wide variety of wafer types and sizes. The model comprises of ultra-precision slides, dual-zone lapping plate assemblies, and integrated process control hardware to provide maximum flexibility and accuracy. AMAT CMP 3600 is ideal for a variety of wafer fabrication processes, including etching, stripping, and patterning applications. It enables the fabrication of complex structures with nano-level accuracy, ensuring tight tolerances and high process yields.
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