Used AMAT / APPLIED MATERIALS CMP 5201 #9093212 for sale
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ID: 9093212
Wafer Size: 8"
Vintage: 2003
Cleaner, 8"
Process: PCUDCU
SMIF Type. FABS
Runs oxide application
Mirra polisher
Mesa cleaner
FABS Cassette system
System controller
Polisher: MB60a1
Cleaner: CB22p2
Endpoint: IB11h7
CPU: Pentium III 400 MHz
Dual RAID hard disk
Hard disk size: 68 GB
RAM: 128 MB
Configurations:
Polisher / with controller Mirra 3400 / 5200
Indexer RORZE FABS
(3) Foup
Slurry (P1+P2+P3) ABCD each
Endpoint laser P1: IScan
Endpoint laser P2: Full scan
Polisher middle skins: Opaque
UPA: Standard
No chiller
Com port server: Digi EL160
Cleaner brush LDM: User modified direct feed LDM
With ENTEGRIS flow sensors
Walking beam: PEEK Fingers with PP grippers
Slurry in CLC
Slurry arm 4 lines
Polishing head: Titan I
Rotary union: 4 ports
Cross type: Cattrack
Platen teflon coated
Pad conditioner type: Universal
Retainer ring type: AEP III
Membrane type: Center bump
PC Diaphragm: Silicon
Brush with core type: PP Core
Upgrade / CIP Retrofit:
LLA Guide pin: Self align
Slider motor 200 W
PM Reduction kit
Queue tub
Membrane UPA filter
Blackout covers
Splash guard
Wind tunnel
Exhaust blower
Magnehelic pressure low level detection kit
SRD Exhaust interlock
Cassette slot run order (From slot 25 down to 1)
2003 vintage.
AMAT / APPLIED MATERIALS CMP 5201 is a precision wafer grinding, lapping and polishing equipment designed to provide the highest level of performance and quality for semiconductor applications. This system uses an automated CMP process to deliver exceptional control over the grinding, lapping and polishing processes to produce the highest levels of surface finishes. AMAT CMP 5201 features a range of configurable parameters, enabling users to adjust the process as needed to achieve precision results. The unit is equipped with a high-precision, high-speed grinding head that uses diamond-tipped abrasive disks to accurately grind the material to a precise depth. The grinding head also has an adjustable pitch that allows for further control of the grinding process. The grinding process is designed to improve surface finish, eliminate defects, and reduce waste. APPLIED MATERIALS CMP 5201 is also equipped with a lapping module for polishing the wafer to a desired finish level. The lapping module uses a combination of diamond lapping compounds and polishing pads to grind and polish the surface of the wafer. This process produces a highly reflective surface that is highly suitable for use in semiconductor applications. CMP 5201 has also been integrated with a wafer chamfering module, which is designed to provide accurate chamfering of the wafers. This technology uses diamond-tipped blades to producing uniform and consistent chamfer cuts on the edges of the wafers. AMAT / APPLIED MATERIALS CMP 5201 also has a fully modular design which allows users to customize the machine to meet specific process requirements. The modular design makes it easy to reconfigure the tool to accommodate new process requirements or to integrate with other components of the production process. Overall, AMAT CMP 5201 is a highly effective asset for producing precision finished wafers for use in semiconductor applications. The combination of reliable grinding, lapping and polishing technology makes it an ideal choice for use in production lines and for achieving the highest levels of semiconductor performance.
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