Used AMAT / APPLIED MATERIALS CMP 5201 #9113497 for sale

AMAT / APPLIED MATERIALS CMP 5201 is a wafer grinding, lapping, and polishing equipment capable of handling up to eight inch (200 mm) wafers. This system works by first grinding the wafer with diamond grinding tools, then lapping with diamond laps and finally polishing with loose diamond abrasive to create a flat, smooth surface. AMAT CMP 5201 includes a robotic wafer manipulator, a media cabinet with two media tanks, and two cleaning systems. The wafer manipulator features a fully adjustable extension arm, with automatic and manual loading modes available. This allows for precise positioning and repeatable operations. The media cabinet is composed of two tanks that are used to grind, lap and polish the wafer from one side to the other. The tanks also feature automatic and manual controls for easy operation. The cleaning systems reduce downtime by providing automatic cleaning of the media tanks between grinding, lapping, and polishing cycles. Additionally, the unit is equipped with an air quality monitor for improved safety and reduced environmental impact. The grinding and lapping process of APPLIED MATERIALS CMP 5201 is designed to finely alter the surface of the wafer by removing material from one side while leaving the other side untouched. To accomplish this, the machine utilizes diamond-coated grinding wheels in various sizes and shapes. The grit size of the grinding media is manually adjusted and monitored for desired results. After the grinding process, the wafers are lapped to further adjust the surface profile and turn it into a smooth, even finish. The diamonds used for lapping are smaller than those used in the grinding process and are applied with a lower pressure to finish the surface of the wafer. Lastly, the wafer is polished with loose diamond abrasive which further smoothens the surface and gives it a bright, reflective finish. CMP 5201 is a versatile, robust wafer grinding, lapping and polishing tool capable of providing consistent, high-quality results for a wide variety of applications. Its adjustable robotic arm, media tanks, and cleaning systems make the machine easy to use and reliable for long-term use. In addition, its air quality monitor ensures operational safety and environmental impact is minimized. As such, AMAT / APPLIED MATERIALS CMP 5201 is an effective tool for achieving high-quality results in wafer polishing operations.