Used AMAT / APPLIED MATERIALS CMP 5201 #9233177 for sale

AMAT / APPLIED MATERIALS CMP 5201 is a highly advanced and precision-engineered wafer grinding, lapping and polishing equipment. It is designed to provide optimal performance for a variety of wafer size and type applications. The system is equipped with an advanced lapping plate control unit (LPCS) which enables users to accurately modulate the whole grinding process and control the surface texture. The LPCS offers precise control of the pressure between the lapping plate and the wafer, resulting in greater accuracy and improved surface quality. It also enables user to run various grinding recipes which maximize process yields, reduce gaps, and achieve a desired surface finish. AMAT CMP 5201 can be loaded with various polishing materials, in granules or fluid suspensions. It can also be used to apply various solutions and compounds such as photoresists. These solutions can be applied to the wafers in layers, enabling the wafer surface to be modified and polished in accordance with a sought after profile. With two grinding heads, the machine further facilitates multi-step grinding operations such as pre-grinding, rough grinding and fine grinding. The tool also features an independent motor controller which provides improved modulatory control of the grinding speed. This allows for more precise and consistent grinding, resulting in superior performance and greater yields. The easy to program selection menus allow users to quickly adjust and fine-tune process parameters with minimal fuss. The many features of APPLIED MATERIALS CMP 5201 combine to make it an ideal solution for wafer processing operations. It is suitable for a wide range of applications and is capable of producing the highest quality results. The asset is designed for low noise operation, which reduces the possibility of environmental contamination while also providing a more pleasant working experience. CMP 5201 is an excellent choice for high-precision wafer grinding, lapping and polishing operations.