Used AMAT / APPLIED MATERIALS CMP Head for Mirra Mesa #293655977 for sale

AMAT / APPLIED MATERIALS CMP Head for Mirra Mesa is the ideal wafer grinding, lapping and polishing equipment for semiconductor device and component fabrication. It is capable of processing a wide variety of substrates, including, but not limited to, Si, Ge, III-V and PCB material. It provides a comprehensive, one-stop solution for both traditional and advanced CMP processes. The head consists of eight different grinding heads with independent process parameters and eight process modules, providing the user with exceptional flexibility in wafer grinding, lapping and polishing. The platform's high-precision, multi-axis spindles provide up to 500 RPM rotation speed, which can be regulated as required to ensure a consistent and repeatable polishing effect. Its high-torque, long duty-cycle spindle design provides a stable foundation for micro-textured grinding & polishing processes, allowing the user to make planar and uneven surfaces. The head is also equipped with a spindle cooling system that helps reduce spindle wear, enabling extended process run times. AMAT CMP Head features a single wafer agitate-to-grind (ITG) technique and regional grinding capability, allowing for higher wafer throughput and improved surface quality. It also offers a detachable single and dual port process option and an auto-width adjustment option. The dual port option enables layering of different materials on the same substrate, making it suitable for multi-layered device production. AMAT CMP Head for Mirra Mesa is equipped with a specialized PLC and HMI interface, providing a graphical user interface and manual control operation as well as options for coding functionality and real-time process monitoring. It enables users to save time in both the tool setup and actual process as it is able to store up to 50 recirculated recipes, reducing the need to reload parametric settings between cycles. APPLIED MATERIALS CMP Head for Mirra Mesa also provides a range of safety features. It offers a power inversion interlock safety switch, light curtains and safety mats to ensure the safety of operators. In addition, the unit offers an array of monitoring features, such as vision camera, auto film detection, and die-eye, to ensure quality control of every polished wafer. Furthermore, the machine offers a range of options and upgrades, including an Adaptive Power Control (APC) feature and automatic wafer identification for easy wafer tracking. The tool can also be integrated with other APPLIED MATERIALS modules, such as Hazimark, or other supplied or third-party systems, for a seamless fully automated wafer fabrication process.