Used AMAT / APPLIED MATERIALS Mesa #293645865 for sale

AMAT / APPLIED MATERIALS Mesa wafer grinding, lapping and polishing equipment is a wafer post-process solution for a variety of semiconductor manufacturing requirements. This system features two high precision machines, a grinding stage and a polishing stage, combined with a versatile software control unit and integrated measurement systems. The grinding stage is responsible for the grinding, lapping, and polishing of both silicon and non-silicon based wafers. Its grinding process is done using either rotary or planetary configurations powered by either DC or AC motors. The machine is capable of supporting a broad range of wafers, including those up to 8 inches in diameter. Replacing the traditional abrasive wheels, the machine implements a closed-loop grinding design, guaranteeing improved surface finish and uniformity for an extended number of wafer cycles. The machine also offers a fully automated grinding process with a versatile software control tool that provides an optimized process cycle and intelligent problem solving tools. Similar to the grinding stage, the polishing stage is used for polishing wafers after the grinding process. The asset is able to polish both silicon and non-silicon based wafers from 4 to 6" in diameter . The polishing process is powered by high precision DC drives and is designed to ensure quick and uniform polishing within a few seconds. The polishing stage also boasts fast changeovers with an integrated mechanical model to ensure repeatable success. In addition, AMAT Mesa wafer grinding, lapping, and polishing equipment comes integrated with an easy-to-use graphical user interface that provides an overall view of all the process parameters and wafer processing, as well as a system layout that allows users to keep an eye on each stage of the process. The unit also includes a comprehensive array of measurement, feedback, and control systems to ensure accurate results. All in all, APPLIED MATERIALS Mesa wafer grinding, lapping and polishing machine is a reliable and efficient post-process wafer solution for a variety of semiconductor manufacturing requirements. With its high precision machines, versatile software control tool, integrated measurement systems, and user-friendly graphical user interface, this asset is an ideal solution for producing high quality results with a minimal amount of time and effort.