Used AMAT / APPLIED MATERIALS Mirra 3400 #9025888 for sale

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ID: 9025888
Vintage: 2005
CMP system with OnTrack Warehoused 2005 vintage.
AMAT / APPLIED MATERIALS Mirra 3400 Wafer Grinding, Lapping & Polishing equipment combines advanced engineering and high-quality manufacturing to provide a fully integrated wafer grinding, lapping, and polishing solution. The system is designed for high throughput and superior surface quality for processing applications requiring the highest in precision and accuracy. This unit is ideal for semiconductor, optoelectronic, and MEMS fabrication processes. AMAT Mirra 3400 features a fully automated material handling machine to maximize process throughput and efficiency. The tool is capable of handling a wide range of wafer sizes and shapes and can support up to four working modules directly. Each module includes its own robot to facilitate rapid loading and unloading of wafers. The wafer grinding, lapping and polishing section includes a digital microspeed control asset which is adjustable over a range of speeds and features a vibration-dampening air bearing spindle that provides superior surface finish. The grinding spindle can be used for both diamond and CBN grinding methods. The lapping and polishing stages are designed with high force and programmable turns, velocity or torque control for reliable and repeatable performance. APPLIED MATERIALS Mirra 3400 also includes an integrated model controller and user-friendly operator interface to monitor, control, and adjust all equipment parameters. This allows the user to easily configure their process settings and view system status and data in real-time. The unit also includes an integrated wafer pre-alignment station for improved process uniformity. In addition, the machine offers an integrated particle measurement station which can be used for the accurate analysis of particle contamination in various stages of the process. This ensures that the tool's process results are reliable and repeatable. The asset is certified to meet cleanroom requirements as well as all major safety standards. Mirra 3400 Wafer Grinding, Lapping & Polishing model is the ideal turn-key solution for a variety of fabrication processes, offering superior performance, accuracy, and throughput. The equipment provides a fully automated process solution for achieving consistent and repeatable results at unmatched speeds and yields, while meeting the most stringent safety and quality standards.
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