Used AMAT / APPLIED MATERIALS Mirra 3400 #9181998 for sale

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ID: 9181998
Wafer Size: 8"
Vintage: 1997
Polisher, 8" Cassette que: (4) Wets Handling: Wet in / Wet out (3) Platens (4) Polish heads Slurry delivery: Peristaltic pump Slurry configuration: A, AB, C ISRM P1: Full scan ISRM P2: Full scan ISRM P4: Full scan UPA: IT/RR/MEM/EC UPA Supply: Nitrogen gas Head types: Profiler (Titan II option) / Titan I/W+ Head ring material: PPS Pad conditioner: DDF3 Min/Max platen speed: 0 - 125rpm Min/Max head rotation: 0 - 125rpm Head sweep range: 4.2 - 5.8 PC Sweep range: 1.7-9.0 Min/Max PC rotation: 0 - 125rpm Min/Max slurry flow: 50 - 240ml/mn Min/Max head pressure: 0.5-14psi Min/Max PC downforce: 3.0-17lbf Endpoint software: IS11e9 Polisher software: PS50g0 Hard drive configuration: NT4.0/68 pin SCSI 1997 vintage.
AMAT / APPLIED MATERIALS Mirra 3400 is a wafer grinding, lapping, and polishing equipment that is used for surface preparation and finishing of semiconductor substrates. AMAT Mirra 3400 is designed to provide both manual and automated operation, as well as a variety of grinding, lapping and polishing operations on a single platform. The system can process multiple substrate sizes, from 150mm to 450mm. APPLIED MATERIALS Mirra 3400 offers four distinct grinding operations, allowing the user to switch from surface grinding to edge grinding with minimal setup time and a variety of polishing operations including single-side or dip-stroking polishing for the most even surfaces. The unit is capable of grinding non-circular substrates, eliminating stress and allowing for more precise processing. Mirra 3400 is also capable of automated preparation and polishing of surfaces. The machine is equipped with a fully automated programmable feed tool and automated linear polishing, giving the user control over the entire process from start to finish. AMAT / APPLIED MATERIALS Mirra 3400's advanced software also allows for fine-tuning of parameters, eliminating the need for tedious manual calibration. AMAT Mirra 3400 has a modular design, allowing for easy upgrades and flexibility. The asset can be reconfigured quickly to allow for the use of multiple grinding, lapping and polishing components, including diamond and diamond hybrid pads, flooding and splashing, as well as surfactant dispensers. For more information, APPLIED MATERIALS Mirra 3400 includes a comprehensive database of grinding and polishing cycles and parameters. Finally, Mirra 3400 is safety-certified, with ESD protection and a safety enclosure allowing for a safe and secure operation. The model also offers environmental protection, with a dust reduction equipment, contained fluid filtration, and automatic shutdown of the grinding and polishing processes in the event of any unforeseen circumstances.
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