Used AMAT / APPLIED MATERIALS Mirra 3400 #9276039 for sale

AMAT / APPLIED MATERIALS Mirra 3400 is a dedicated wafer grinding, lapping, and polishing equipment that provides high precision memory and magnetics device patterning. It is designed to precision clean and polish individual wafers or batches of wafers. The system utilizes a low pressure, high pressure, warm water and cool water containment unit to achieve maximum efficiency. AMAT Mirra 3400 consists of two main components: the wafer preparation station, and the lapping and polishing subsystem. The wafer preparation station is used to clean, deglaze, and systemize the wafers prior to processing in the lapping and polishing machine. This includes a deglazing solution, an abrasive material, and a vacuum tool, as well as a mask to protect the wafers from damage. The lapping and polishing subsystem includes a unique, multi-axis robot arm that moves the wafers from the preparation station to the diamond lapping disks. The robot arm is capable of precision placement of wafers to ensure that wafers maintain a consistent radius of curvature throughout the process. The wafers are then securely clamped into a diamond lapping disk, which spins the wafer providin a uniform surface finish. The diamond lapping disks are then moved to the polishing station, where the wafers are subjected to further cleanses and polishes. The polishing station utilizes a series of specialized polishing fluids and abrasive media to achieve the desired finish and surface profile. Once the desired surface finish is achieved, the wafers can either be optionally moved to a post-processing station or an etching station that is designed to improve feature accuracy or refine its profile. The lapping and polishing asset can be adjusted for different wafer sizes and is capable of processing a variety of wafer materials including silicon, aluminium, sapphire, and ceramic. APPLIED MATERIALS Mirra 3400 is a reliable and high-precision model that provides a quick, efficient, and comprehensive wafer grinding, lapping and polishing process. It is an ideal solution for the production and patterning of memory and magnetics devices, and is capable of producing high-quality and consistent surface finishes.