Used AMAT / APPLIED MATERIALS Mirra 3400 #9411057 for sale
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ID: 9411057
Vintage: 2001
CMP System
Wet robot
Wet queue tank: Q-Tank with lift
System skins: Clear skins
Load cup: Full contact HCLU
Performance enhancement:
Pad conditioner head 1-3 with screw type DDF3
Factory interface:
Platen 1 ISRM: Legacy
Platen 2 ISRM: Legacy
Platen 3 ISRM: Legacy
SECS GEM Interface
Polisher:
No polishing head 1-4
Upper Pneumatics Assembly (UPA): Profiler
No UPA relocation
Pad wafer loss sensor: Dual sensor
No platen temperature control and cable
No upper platen coating
Grease platen gear assembly
Slurry delivery: Peristaltic pump
Standard slurry flow rate
Slurry dispense arm:
4-Line slurry arm
High pressure rinse
DI Water
Slurry tube
Facilities operations:
EMO guard ring
No EMO IO
System user and labels: English
No LOTO Box
Smoke detector
Polisher slurry leak sensor
Electrical requirements:
Line frequency: 50 HZ
Line voltage: 200/208 VAC
Power lamp: Green lamp
No power connected lamp
Circuit breaker: 200 A
Controller top panel: Holes punched out for AC Power cables entry
No configurable IO
GFI Type: 30 mA
No isolation transformer
Umbilical's:
CAT Track style: Cascading
Polisher to controller cable
Controller to monitor cable: 50 feet
Factory hookup:
Upper exhaust
Upper exhaust material: Stainless steel
Lower exhaust
Process exhaust: Vent interlock sensor
No flange upper exhaust connection
Drain manifold: 1 Line
Operator interface:
No Hard Disk Drive (HDD)
Memory: 128M
PIII CPU
Operating system: Windows NT
Polisher light tower:
Pole mounted type
Polisher tower: (3) Colors
Lamp type: Incandescent
Colors sequence: RYG
Controller light tower:
Pole mounted type
(3) Colors
Lamp type: Incandescent
Color sequence: RYG
2001 vintage.
AMAT / APPLIED MATERIALS Mirra 3400 is a wafer grinding, lapping and polishing equipment, specifically designed for use in the semiconductor manufacturing industry. The system uses a multi-stage polishing unit, which includes a rotating horizontal wafer holder and diamond grinding wheels. The machine is capable of producing extremely high quality surface finishes, with smooth surfaces and low micro-roughness values. The main components of AMAT Mirra 3400 are the mainframe, transfer unit, and integrated process control tool. The mainframe is equipped with a 10 HP motor, with adjustable speeds of up to 2000 rpm. The transfer unit includes two servo motors, allowing for automatic material-handling of the wafer and its associated substrates. This ensures accuracy and precision while the wafer is being lapped or polished. The integrated process control asset is capable of controlling the grinding, lapping and polishing process, as well as storing parameters and recipes for each type of wafer. APPLIED MATERIALS Mirra 3400 can accommodate a variety of wafer sizes and thicknesses, from 1 inch to 8 inches. The model also has built-in safety features to protect the integrity of the wafers. The wafer is grinded/lapped in stages, from coarse to fine depending on the wafer's surface finish requirements. Once the grinding is complete, the wafer is then polished with a polishing solution, and finished with a fine lapping or polishing compound. The equipment is capable of achieving very tight tolerances and surface roughness values, in the range of 1-2 µm, making it suitable for the production of high quality wafers. The system also utilizes automated vacuum technology to help reduce contamination, resulting in higher yields. Overall, Mirra 3400 is a robust and reliable unit which offers data logging and post-processing capabilities to ensure the quality of the finished product. The machine is capable of producing very smooth results with tight tolerances, making it the ideal choice for the semiconductor industry.
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