Used AMAT / APPLIED MATERIALS Mirra / AS 2000 #9293802 for sale

AMAT / APPLIED MATERIALS Mirra / AS 2000 is a high-end wafer grinding, lapping, and polishing equipment used by semiconductor manufacturers to produce ultra-precise, nanoscale features on microelectronic wafers. AMAT Mirra / AS 2000 utilizes a unique combination of precision grinding, lapping, and polishing technologies to achieve superior surface finish and critical dimension control. The system's modular design provides exceptional flexibility and throughput, allowing users to customize their unit to match their specific needs. APPLIED MATERIALS Mirra / AS 2000 comes equipped with a robust grinding and polishing head, designed to deliver precise results with minimal operator interactions. The head can be configured with various abrasive materials, diamond wheels, or lapping/polishing compounds to suit a variety of applications. The head can also be equipped with an integrated coater/hydrocyclone for controlling slurry liquids. High-precision, servo-driven, wafer carriers provide seamless control and accuracy to the process while a vision unit is used to perform real-time measurements of the wafer surface. Advanced automatic features, such as the wafer tracking machine, enable the user to track and monitor the wafer through the course of production. Mirra / AS 2000 also includes an Integrated Process Control Tool (IPC), allowing users to optimize the process for their application. The IPC functions as an intelligent process agent, which automatically adjusts parameters based on configured setpoints and detected wafer signal. In addition, the asset's fast cycle time and intuitive user interface eliminate the need for manual tuning and monitoring, thereby reducing operating costs. Overall, AMAT / APPLIED MATERIALS Mirra / AS 2000 provides cutting-edge technology and exceptional precision to semiconductor manufacturers. With its modular design and integrated automation features, the model helps users decrease cost and improve yields in even the most challenging applications.