Used AMAT / APPLIED MATERIALS Mirra / AS 2000 #9293819 for sale

AMAT / APPLIED MATERIALS Mirra / AS 2000 Wafer Grinding, Lapping & Polishing Equipment is a large-scale, automated production machine developed and produced by AMAT, Inc. Designed for use by semiconductor, medical, and research institutions, it is a versatile and powerful unit whose purpose is to grind and polish wafers of various shapes and materials at high speeds. The system consists of two main components - the main touch screen console and the grinding/lapping/polishing unit. Both of these components communicate via the high-speed Industrial Network, allowing for fast and efficient operation. The main touch screen console is the brain of the unit and contains a variety of programs which control the grinding/lapping/polishing process. It includes a user-friendly interface for uploading process maps and setting the parameters of the unit. It's also equipped with a recipe library, so desired modifications can be easily obtained and stored for future use. The grinding/lapping/polishing unit(s) are the actual working parts of the machine. They each have an individual motorized spindle that can accommodate up to 12" (300mm) wafers. The motors on the unit are individually adjustable to the desired speed and power setting in order to achieve the desired result in the shortest amount of time. Additionally, they contain a water-cooled grindstone, a precision lapping wheel, and a cylindrical or conical polish wheel. The grinding/lapping/polishing process has three primary stages. First, the wafer is mounted on a clamp and the grinding wheel is used to rough grind the wafer material down to its intermediate shape. Once the rough grinding is complete, the lapping wheel is used to finish the grinding surface, producing an even finish on the entire surface with minimal defects. Finally, the polishing wheel polishes the surface to achieve the desired level of reflectivity, clarity, and smoothness. Overall, AMAT Mirra / AS 2000 Wafer Grinding, Lapping & Polishing Tool is a versatile, powerful and efficient tool that can produce high-quality wafer surfaces in a rapid production environment. This asset enables users to grind and polish up to 12" (300mm) wafers with a high degree of accuracy and success. With its easy-to-use graphical user interface, precision cutting and polishing tools, and automated processes, this machine provides high repeatability with minimal waste.