Used AMAT / APPLIED MATERIALS Mirra Integra #9265796 for sale
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ID: 9265796
Wafer Size: 6"
Vintage: 1998
System, 6"
Box 1:
Type: Through-the-wall
(4) SMIFs
CPU Board type: 400 MHz or Higher
Box 2: Mirra Track
Box 3: Oxide
Box 4: Dry in / Dry out
Box 5:
Signal lamp tower
No Bolt-on SMIF
No integrated SMIF
Box 6:
Cassette tank: Standard
Robot type: 112" Stand alone
Cleaner type: ONTRAK
Spray gun: Single
No In-situ removal rate monitor
No IPM
Box 7:
Polish heads: Titan 1
Rings: AFP
Wafer loss sensor: Dual sensor
Box 8:
Teflon coated platens
Pad type: IC 1000
Pad conditioner head: DDF3
Pad conditioner disc: TBW
Universal disk holder
Temperature control: None
Box 9:
Slurry / Platen used
Flow rate: Standard
Dispense arm: Standard
No slurry flow monitors
Box 10:
Nova type: Wet out
No interface monitor
No notch finder
Box 11:
Membrane type: FPDM
4-Port UPA upper
Box 12:
Polish heads: 6" Titan
Grooved retaining rings
Dark pad wafer loss sensor
Box 13:
Pad type: IC 1000
Pad conditioner disc: ABT
Universal disc holder
Box 14:
MESA Cleaner type
On-board mixing
Chemical A: Ammonia Hydroxide
Pressurized delivery type
Precision spray bar
CLC Brush box with on-board mixing
Scrubber 1 and 2:
Brush type: Rippey microclean
Delivery type: Direct feed
Manuals and cables included
Power supply: 208 V, 3 Phase
1998 vintage.
AMAT / APPLIED MATERIALS Mirra Integra is a wafer grinding, lapping and polishing equipment that is designed for high efficiency machining of brittle materials with a wide range of abrasive media. This system is used for a variety of applications including the production of semiconductor and MEMS devices. The unit is composed of a base unit, which houses the grinding wheels and lapping plates, and a controller unit which allows the user to control the grinding equipment and adjust the parameters to meet the desired results. AMAT Mirra Integra has a robust construction with an aluminum chassis, stainless steel work plates and ceramic components. The grinding machines used in APPLIED MATERIALS Mirra Integra have a high degree of precision and accuracy. The grinding wheels are designed to provide consistent results across the entire material surface. The grinding media is optimized to reduce plate abrasion and minimize damage to the workpieces. In addition, the grinding media is also capable of accommodating surface-disparate substrates. Mirra Integra's lapping plates are designed to provide a uniform grinding surface, which evenly distributes the stress across the work surface. This helps to reduce the stress on the workpiece, resulting in lower surface roughness and improved part life. The lapping plates are equipped with two adjustable clamps that enable them to be adjusted to suit the specific application requirements. AMAT / APPLIED MATERIALS Mirra Integra's polishing process uses a combination of chemical and mechanical methods to achieve a high quality polished result. The polishing media used is engineered to enable a controlled and consistent finishing procedure, resulting in highly precise results. AMAT Mirra Integra's automated process control machine allows the user to adjust the grinding equipment parameters to ensure optimal results. The controller also provides feedback on the workpiece surface roughness and can trigger an alarm when pre-determined thresholds are exceeded. Overall, APPLIED MATERIALS Mirra Integra is an exceptionally advanced and reliable wafer grinding, lapping and polishing tool that can be used to achieve high precision results in a fraction of the time.
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