Used AMAT / APPLIED MATERIALS Mirra Mesa #9075137 for sale

AMAT / APPLIED MATERIALS / AKT Mirra Mesa wafer grinding, lapping and polishing equipment is a multi-functional system with a maximum wafer diameter of 200mm and a maximum wafer thickness of 6.5mm. This automated unit is ideal for applications that require high performance and precision while also minimizing waste production. The machine comprises a single substrate support with an adjustable drive wheel that helps control wafer rotation speed. The substrate support is supported on a linear-motion stage that allows for accurate three-dimensional positioning of the substrate in the grinding, lapping, and polishing process. In addition, the tool is equipped with an extractor that helps maintain cleanliness of the processing chamber while also removing the material grinding away from the wafer. The asset is capable of grinding, lapping and polishing flat and radius wafers with a speed range of up to 35,000 RPM. The advanced dynamic rotor uses centrifugal force to apply the proper grinding force to the abrasive media throughout the entire grinding cycle, ensuring uniform material removal from the substrate surface. The model also offers two polishing heads that can be used for specialty applications. The first head is designed for general polishing and incorporates an air jet cleaning equipment which can be used up to a maximum speed of 10,000 RPM. The second head is a high-resolution polisher for finer finishes and finer material removal. The system also offers advanced process monitoring capabilities that provide real-time information such as process time, grinding force, and abrasive particle size. This helps eliminate waste and ensure a high-quality result. Furthermore, the unit's advanced automation features enable semi-automated processes that reduce operator involvement and provide for greater process control. Overall, AKT Mirra Mesa wafer grinding, lapping and polishing machine is a perfect solution for applications that require precision and reliability. The tool's dynamic rotor, high-resolution opto-electronic sensing capabilities, and advanced automation features all contribute to its high performance and accuracy, while its advanced process monitoring capabilities help minimize waste and ensure consistently high-quality results.