Used AMAT / APPLIED MATERIALS Mirra Mesa #9105123 for sale

AMAT / APPLIED MATERIALS / AKT Mirra Mesa equipment is a comprehensive advanced wafer grinding, lapping & polishing system. This unit is specifically designed for the grinding, lapping, and polishing of both silicon and compound semiconductor wafers. AKT Mirra Mesa machine's advanced productivity and performance are based on its state-of-the-art design and reliable wafer grinding and polishing tool-set. The tool comes with a full range of 3D imaging and grinding tools that provide high-precision, repeatable performance. AMAT Mirra Mesa's 3D imaging capabilities include high resolution microscopic imaging, stereo focusing and advanced fractional power grid scanning. This allows engineers to accurately and precisely image multiple wafer layers simultaneously. Mirra Mesa's 3D imaging tool-set can also be used to facilitate process development for a variety of different materials and processes. APPLIED MATERIALS Mirra Mesa's wafer grinding tool-set includes diamond grinding wheels, grinding plates, grinding belts, autoclave systems, and wafer heating elements. The precision grinders and lappers within AMAT / APPLIED MATERIALS / AKT Mirra Mesa asset can produce high-accuracy wafer edges with very small amounts of material removal. The wafer lappers, carriers and loading systems enable efficient, repeatable lapping and polishing for a variety of applications. AKT Mirra Mesa model also features a robust and reliable polishing tool-set. This includes ion-assisted polishing systems and compounds to provide a range of polishing speeds and finishes. The polishing tools also enable the use of automated polishing programs, allowing users to customize their polishing and finishing parameters. The equipment also has the ability to support multiple polishing protocols to precisely control and monitor the polishing of wafers. The advanced design of AMAT Mirra Mesa system also enables accurate, repeatable wafer grinding, lapping and polishing. The advanced wafer control systems and software are designed to provide the user with real-time control over the entire grinding, lapping and polishing process, providing efficient, repeatable results. In conclusion, Mirra Mesa unit is an advanced and reliable wafer grinding, lapping and polishing machine. The tool is designed to provide high-precision and repeatable performance, and its comprehensive 3D imaging and grinding, lapping and polishing tool-set enable precise wafer processing. APPLIED MATERIALS Mirra Mesa's advanced wafer control asset and software further enable precise and repeatable wafer grinding, lapping and polishing, providing efficient, precise and reliable results.