Used AMAT / APPLIED MATERIALS Mirra Mesa #9119027 for sale

AMAT / APPLIED MATERIALS / AKT Mirra Mesa Wafer Grinding, Lapping and Polishing Equipment is a fully automated single-wafer polishing system designed to offer the highest levels of sub-micron precision and surface finish quality for wafers in the semiconductor and optoelectronics industries. This machine utilizes an integrated platen with fixed grinding abrasives to grind, lap and polish the semiconductor wafer. It is equipped with a spindle that is driven by a servo-motor with feedrate control for precise and repeatable material removal. The unit also features a computer-controlled machine that allows for programming of grinding parameters, such as speed, stroke rate, cutting pressure, and cycle time. The tool is designed with advanced design and construction that offer the user high-precision control for achieving the best possible wafer surfaces. It can be used to process a wide range of wafer material including Silicon, Gallium Arsenide (GaAs), Indium Phosphide (InP), and other compound semiconductor materials. In addition, the asset also includes a vacuum chuck for optimal polishing and fast evacuation of high-quality particles from the polishing and grinding media. With its innovative design, AKT Mirra Mesa offers excellent performance, reliability, and reproducibility. It is the ideal machine for precision wafer grinding, lapping and polishing.