Used AMAT / APPLIED MATERIALS Mirra Mesa #9196931 for sale

AMAT / APPLIED MATERIALS / AKT Mirra Mesa wafer grinding, lapping & polishing system is a precision machine designed to produce ultra-smooth silicon wafers for semiconductor applications. This technology utilizes a grinding wheel, a lapping plate, and a polishing cloth in unison to achieve the desired surface finishes. The grinding wheel efficiently removes large amounts of material from the wafer substrate. It operates with diamond or carbide abrasive particles which is mounted to a metal spindle that rotates at high speeds. With the proper duration and pressure, the grinding wheel can efficiently remove features such as burrs, pits, and other smooths the surface of the wafer. The second stage of the process is lapping, which involves using a flat lapping plate and abrasive slurry to smooth the wafer. The lapping plate has an abrasive on one side which is constantly polished while being continuously pressed against a rotating wafer substrate. This results in a flat mirror finish to the wafer, removing any micro fibers and pits. The final stage is polishing. Polishing is done using a cloth-discolored polishing wheel that is loaded with different types of micro abrasive particles for a fine finish and enhanced surface reflectivity. This is done by pressing the polishing wheel against the rotating wafer making use of different techniques such as diamond paste, slurries, and various chemical agents to eliminate any remaining surface defects. The entire process is monitored in real time utilizing clean room protocols and its results are validated using particle analysis methods and measurements of surface roughness. AKT Mirra Mesa's advanced design ensures that wafers are produced meeting the most stringent quality requirements, allowing for the production of precision semiconductor devices.