Used AMAT / APPLIED MATERIALS Mirra Mesa #9222045 for sale
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ID: 9222045
Wafer Size: 8"
Vintage: 1997
CMP System, 8"
Technology: CMP STI
Wafer shape: Flat
Application information:
Application: Oxide
System: Dry in / Dry out
Device type: D-RAM
Device geometry: 0.13 Microns
Consumed process materials:
Polish slurry: STI
Platen 1 pad: IC1010
Platen 2 pad: IC1010
Platen 3 pad: IC1010
Pad conditioner: Diaphraghm
Pad conditioner head: DDF3
Pad conditioner holder: Standard
Factory interface options:
Cleaner type: MESA (Converted from reflexion)
Megasonics
Robot type: AMAT
In situ removal rate monitor: Digital
SECS GEM Interface
Cassette tank
Open cassette
Integrated system basic: Fabs 212
Platen and head options:
Polishing head: (4) TITAN I Heads
(4) Retaining rings
Pad wafer loss sensor
Slurry delivery options:
Slurry delivery: (2) Slurries by peristalic pump
Slurry flow rate: STD Flow
Slurry flow monitor
Slurry containment bulkhead
Slurry loop line: No
Slurry dispense arm: Extendad rinse arm
Slurry leak detector: No
DI Water
High pressure rinse
Umbilicals:
Polisher to controller cable: 30 Ft
Controller to monitor cable: 30 Ft
Factory hookup:
Upper exhaust: Standard
Upper exhaust connection: 8"
Drain manifold: 4 Line to Fac
Drain adapter: NPT Fitting
Castors for mirra system: No
Weight distribution plate (Skid pad)
User interface:
Stainless cart
PC Mouse
Hard disk backup: No
Polisher / Fabs light tower:
Tower mounting type: (4) Lights
Tower colors sequence: RYGB
(4) Tower colors
Cleaner option: Mesa cleaner
Maintenance options:
Spray gun: Single
Lapping stone: No
Special options:
Nylon brush: No
E-Chain teflon sheet: Water fall
Low pressure release water: No
Mesa:
Direct checm type:
Megasonic module
Brush 1
Brush 2
Standard:
SRD
Output station
Electrical requirements:
Line voltage: 200~230V
Line frequency: 50/60 Hz
Delta connection
Power lamp: Green
Power connected lamp: No
Circuit breaker: 200A
AC Outlet box: 100V
Configurable I/O: No
Wide type GFI: 50mA
1997 vintage.
AMAT / APPLIED MATERIALS / AKT Mirra Mesa is an automated wafer grinding, lapping and polishing equipment used to prepare semiconductor wafers for advanced thin film processes. It is capable of grinding, lapping and polishing wafers in a single system, eliminating the need for multiple pieces of equipment. AKT Mirra Mesa is a state-of-the-art, highly efficient unit. Its features include fully automated grinding, lapping and polishing cycle times, as well as robotic loading and unloading of wafers, and global command and control. It provides high throughput, high quality results, and can process up to 200 wafers per hour. The machine is capable of grinding, lapping and polishing wafers up to 8" in diameter. Its polishing processes ensure smooth, defect-free surfaces with Ultra-Low K values, which is essential for devices that require extra thin films. The tool also utilizes MultiGrit™ technology, which minimizes the number of polishing steps required and ensures a uniform surface finish. AMAT Mirra Mesa is configurable to meet the specific needs of each process. Its modular design allows for easy integration with existing processes, while its high-efficiency operation enables minimal cost of ownership. In addition, it can be interfaced with operator consoles, as well as with other computers, to maximize asset efficiency. The model is also highly reliable; its self-monitoring and self-calibrating abilities reduce downtime. Safety systems are also in place to protect personnel and wafers. Overall, APPLIED MATERIALS Mirra Mesa is a highly efficient, advanced wafer grinding, lapping and polishing equipment, capable of producing highly consistent results. Its configurability, high throughput and low cost of ownership make it the ideal choice for today's most demanding semiconductor processes.
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