Used AMAT / APPLIED MATERIALS Mirra Mesa #9228448 for sale

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ID: 9228448
Wafer Size: 8"
Vintage: 2004
CMP System, 8" Process application: Oxide & Poly EMO Type: Push bottom Status light tower: Red Yellow Green FABS Configuration: Type: SMIF / (3) Ports Robot blade Robot No calibration computer Fan unit Floppy disk Polish module: Head type: Titan I HCLU Single wafer loss sensor (3) Slurry arms type: Short No facilities interface panel Pad conditioner type: Cylinder (3) Pad conditioners Remote monitor: Table mount Wet robot Wet robot blade Queue tank Queue tank cassette (4) Heads (4) Rotation units (4) UPA Sets (4) Spindles (4) NSK Rotation motors (4) Head sweep motors (4) Head sweep slider assemblies (4) Head clamps (3) Platens (3) Platen motors (3) Platen gearboxes MESA Module: Megasonics delivery type: Pressurized AP50 Pump Direct BU1 &BU2 Delivery type No SRD heater lamp Upper electronics box Working beam Input shuttle type: Half-moon Chemical configuration: HF Slurry flow type: Slurry pump NH4OH CE Safety mark: English CIM Configuration: SECS Electrical configuration: Line voltage: 208 V Full load current: 170 A Frequency: 50-60 Hz 2004 vintage.
AMAT / APPLIED MATERIALS / AKT Mirra Mesa wafer grinding, lapping, and polishing equipment is an automated system designed for high precision lapping and polishing of silicon wafers. This unit has been designed with ultra-precise performance and a variety of options, including the ability to easily customize technologies to meet any customer's unique needs. This machine is designed for a high level of productivity, reliability, and efficiency. The tool features a high precision precision lapping and polishing plate with a constant recirculating environment. The precision plate is made of a unique non-scratch material designed to ensure quality results with minimal surface damage. The precision plate is driven by an adjustable speed drive motor, allowing for exact control of the speed and direction of lapping and polishing operations. AKT Mirra Mesa also features an integrated laser interferometer asset for monitoring and controlling lapping speeds and accuracy. The laser interferometer provides data on the exact position and rates of the lapping operations, allowing the model to modify the lapping speed and parameters as needed to maintain desired process times. The integrated user-friendly graphic interface allows users to easily control and monitor the equipment. The system also incorporates a high-precision water jet pump unit, allowing for optimum water flow rates for lapping and polishing operations. The optimized water jet machine allows for faster, quieter, and smoother lapping operations. The tool is also designed with a unique dust and particles extractor for removing dust particles and other contaminants from the lapping and polishing plates. AMAT Mirra Mesa also features a unique dust cover asset designed to protect the entire package from dust and other contaminants. Additionally, the model is designed with a sophisticated cooling equipment to quickly cool down the plates and minimize thermal related issues. APPLIED MATERIALS Mirra Mesa wafer grinding, lapping, and polishing system is an engineered solution for lapping and polishing silicon wafers with precision and accuracy. The integrated user-friendly graphical interface and wide range of options allow for simple and efficient wafer preparation. The unit's advanced technologies ensure quality, reliability, and productivity with fast turnaround times for preparing silicon wafers.
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