Used AMAT / APPLIED MATERIALS Mirra Mesa #9232743 for sale

AMAT / APPLIED MATERIALS / AKT Mirra Mesa is an automated wafer grinding, lapping and polishing equipment designed to precisely grind, lap, and polish semiconductor wafers. The system consists of a base frame, a wafer handling robot, a three-axis gantry, two spindle drives, and an integrated wafer lapper and polisher. The wafer handling robot features X, Y, and Z axes of movement and can operate at velocities up to 1 m/s with sub-micron positioning repeatability. It is capable of pickup and loading of the wafers, and is equipped with a force controlled feeder for operator-controlled feed rates. The robot is also equipped with safety interlocks to ensure operator safety and help protect the unit from mishandling or other accidents. The triple-axis gantry is used to position the grinding and lapping spindles as well as the wafer robot. It features X, Y and Z axes of movement with a positioning accuracy of up to 0.01mm. It is driven by two independent high torque DC motors and controlled by an advanced motion controller. The two spindle drives are used to spin the grinding and lapping spindles, and feature a variable speed drive up to 1400 RPM for the grinding spindle and up to 8200 RPM for the lapping spindle. The machine also features an automated wafer lapper and polisher, which is used to lap and polish the wafers to a predetermined thickness and surface finish. This is done by using a processing head and abrasive film, which is capable of achieving up to 3µm processing accuracy with repeatability up to 0.3µm. AKT Mirra Mesa is an automated tool designed to precision grind, lap and polish semiconductor wafers and features a high-end motion control asset, two spindle drives, and an automated wafer lapper and polisher. Its excellent positional repeatability and accuracy as well as its ability to achieve precise wafer thicknesses and surface finishes make it an ideal model for a variety of wafer grinding, lapping and polishing applications.