Used AMAT / APPLIED MATERIALS Mirra Mesa #9232935 for sale

AMAT / APPLIED MATERIALS / AKT Mirra Mesa Wafer Grinding, Lapping & Polishing Equipment is a precision wafer processing system that provides a variety of advanced wafer processing capabilities. Developed by AKT and AMAT, AKT Mirra Mesa unit is capable of highly accurate rough grinding, lapping, and polishing of various wafer substrates. To ensure consistent, high-precision grinding, lapping, and polishing of wafers, AMAT Mirra Mesa machine features an automated process control tool that uses position and velocity feedback loops to precisely locate the specified surface, maintain position vibrations to <10 angstroms, and ensure that all surfaces are equally ground/polished. The asset also features a high-speed digital video camera that continuously monitors all critical process parameters. Mirra Mesa model is designed with a single-plate design that holds up to 8 wafers, providing improved thermal and mechanical stability for the entire grinding, lapping and polishing process. A self-contained hand-pump provides direct lapping pressure to the newly-ground wafer surface, while the primary air bearing spindle initially reaches speeds up to 5,000 rpm can be configurable up to 10,000 rpm. The equipment utilizes a waveform generator to ensure even grinding, lapping, and polishing to a specified depth of cut. APPLIED MATERIALS Mirra Mesa system is a highly reliable and efficient wafer processing unit that can perform a variety of wafer processing requirements, including but not limited to grinding, lapping, polishing, and other processes. This machine also features a full range of environmental controls and safety features that ensure that your wafers and processes stay consistent, free of contamination, and compliant with quality standards. AMAT / APPLIED MATERIALS / AKT Mirra Mesa tool has the potential to reduce errors, improve wafer yield, and save resources through improved process control and automation capabilities.