Used AMAT / APPLIED MATERIALS Mirra Mesa #9247384 for sale

AMAT / APPLIED MATERIALS Mirra Mesa
ID: 9247384
Vintage: 2004
Chemical Mechanical Polish (CMP) system 2004 vintage.
AMAT / APPLIED MATERIALS / AKT Mirra Mesa Wafer Grinding, Lapping & Polishing Equipment is a versatile, high precision, and high throughput system designed to grind, lap, and polish a variety of precision substrates for a variety of applications. The unit is made up of a base machine, with a large, circular grinding head, two linear lapping plates, two small rotary polishing heads, a semi-auto loader, and an optional automated analyzer. The grinding head is designed to provide high precision material removal from the wafer edge during grinding operations. The two linear lapping plates are designed to provide a simultaneous, uniform grinding across the wafer surface, limiting kerf loss, while the smaller rotary polishing heads provide a smooth, polished finish to the wafer edge, allowing for the highest level of mechanical planarity. The semi-automatic loader is included to provide loading and unloading automation, eliminating the need for manual loading and unloading, while the optional automated analyzer allows for an inspection of the wafer's surface finish, mechanical planarity, and profile. The machine is also highly automated and easy to use, with a simple menu-driven user interface that can be easily configured to meet the needs of any process requirement. It also features a variety of safety features to ensure the safety of operators and the protection of the tool's components, including a safety interlock and a pressure sensing asset. AKT Mirra Mesa Wafer Grinding, Lapping & Polishing Model is designed for a range of applications, from precision semiconductor wafer grinding and lapping, to high-volume wafer manufacturing processes. It is ideal for tasks like sintering, backside grinding, etching, polishing, and much more. The equipment is also able to produce a continuous surface finish along with a uniform planarity and depth of cut, allowing for the most precise results. AMAT Mirra Mesa Wafer Grinding, Lapping & Polishing System is the perfect choice for any precision fabrication process that requires superior material removal and the highest level of surface finish. With its advanced automation and safety features, it is an excellent choice for high-volume production, offering stability, accuracy and reliability.
There are no reviews yet