Used AMAT / APPLIED MATERIALS Mirra Mesa #9280807 for sale

AMAT / APPLIED MATERIALS / AKT Mirra Mesa wafer grinding, lapping and polishing equipment is a precision device designed for the fabrication of wafers used in semiconductor processing. The system is designed to provide high accuracy and reliability in the production of wafers from the earliest stages of the process. The unit utilizes a unique combination of grinding, lapping and polishing heads to provide both a fine finish on the surface of the wafer and a uniform depth. AKT Mirra Mesa is capable of accommodating wafers up to 8-inches in diameter and features a maximum wafer diameter of 200 mm (8-inch). The machine's grinding head features a three-axis adjustment tool that allows for precise grinding and polishing. The adjustable grinding and polishing head has adjustable movement along the x, y, and z-axes to provide the necessary adjustments when producing wafers of varying sizes and complex shapes. The grinding head comes with a wafer transfer asset to help facilitate chip loading and wafer unloading. The model is also fitted with a wafer fault detection tool, which can detect medium and large defects in the wafer during the grinding and polishing process. The lapping and polishing process is done using an adjustable pressure-controlled equipment, which can be optimized to provide a high quality finish on wafers. The system also features automatic wafer cleaning, as well as the ability to manually clean wafers with a brush. AMAT Mirra Mesa unit's design also allows for a variety of wafer testing, such as thin wafer testing to identify any defects that occur in the process. In addition to wafer grinding, lapping and polishing, Mirra Mesa machine also has in-situ capabilities. In-situ capabilities allow operators to monitor and adjust the cutting process while the wafer is still in the tool, which improves accuracy. The asset also has optional features, such as a laser scan inspection model and a microscope-based inspection equipment, to inspect the quality of the final product. Overall, APPLIED MATERIALS Mirra Mesa wafer grinding, lapping and polishing system is a comprehensive unit that is designed to produce high quality wafers in the most efficient way possible. The machine utilizes a unique combination of grinding, lapping and polishing technology coupled with the ability to adjust the tool to accommodate wafers of varying sizes and shapes. AMAT / APPLIED MATERIALS / AKT Mirra Mesa asset is also capable of conducting a variety of wafer testing and has a range of optional features, such as in-situ capabilities, to further improve accuracy and quality control in the production of wafers.