Used AMAT / APPLIED MATERIALS Mirra Mesa #9313441 for sale

AMAT / APPLIED MATERIALS Mirra Mesa
ID: 9313441
Vintage: 2000
CMP System 2000 vintage.
AMAT / APPLIED MATERIALS / AKT Mirra Mesa is a premier wafer grinding, lapping, and polishing equipment. This versatile system is capable of providing precise and consistent machining results on virtually any substrate material—including quartz, sapphire, and silicon, among others. With its various stages and functions, the unit is capable of supporting a variety of detailed processes and operations such as applied force grinding and slurry lapping, resin and diamond impregnation and polishing, and cleaning and research applications. In terms of performance, the machine's slurry lapping stage is powered by a high-torque brushless motor, allowing for exceptional processing speeds. Additionally, the tool employs microprocessor and automatic computer-controlled technology to maximize processing consistency. The asset uses a four-flap arrangement with high pressure adjustment, as well as three simultaneous common outputs, to ensure precise results. This also provides a far more precise countertop construction that helps to reduce potential flaws. Further, the model is designed with user-friendly features and advanced safety features such as an emergency stop button, full enclosure and low-noise operation. Additionally, it is equipped with vibration and noise suppression to reduce tool life loss caused by machine vibration and lessen their impact on the surrounding environment. Additionally, the ergonomic design provides a comfortable working environment and the easy-to-use interface ensures easy equipment operation and programming. The system comes with a comprehensive service package, which includes engineering support and custom machine-building options. The reliable and durable design also helps to ensure reliable performance for many years to come. With its innovative technology, safety features, and advanced performance, AKT Mirra Mesa is an ideal choice for a variety of wafer grinding, lapping, and polishing needs.
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