Used AMAT / APPLIED MATERIALS Mirra Mesa #9398753 for sale

AMAT / APPLIED MATERIALS Mirra Mesa
ID: 9398753
Wafer Size: 8"
Vintage: 2001
CMP System, 8" 2001 vintage.
AMAT / APPLIED MATERIALS / AKT Mirra Mesa is a cutting edge wafer grinding, lapping, and polishing equipment designed to deliver robust, repeatable, and accurate results for semiconductor fabrication and testing processes. This system uses a rotary grinding wheel, chemical-mechanical polishing (CMP) slurries, and abrasive lapping slurry to fabricate the wafers. The wafer grinding consists of moving the wafer against the grinding wheel in a small, controlled motion to achieve a consistent surface finish. Subsequent to the grinding process, the lapping process is used to smooth out any irregularities and produce a homogenous surface. The lapping process consists of a slurry containing abrasive particles being circulated onto the wafer while the wheel moves in a circular motion against it. Finally, the polishing process comprises of optionally adding more abrasives and polishings agents to the slurry and subjecting the wafer to the wheel in a continuous process. This creates a consistent and highly-accurate finish on the wafer. AKT Mirra Mesa is equipped with a control unit for managing the process parameters, wafer real-time monitoring and metrology displays, and an interface with external metrology instruments. Additionally, the machine is designed to provide high performance, as well as high yield with comprehensive fault detection and process run-time checks. The tool also comes with automatic wafer preparation, which automates the wafer cleaning and lithography processes, further simplifying and optimizing the entire material surface preparation process. AMAT Mirra Mesa offers a highly efficient and cost-effective way to fabricate high precision wafers. Its wide range of capabilities make it suitable for most regimes of wafer grinding, lapping, and polishing and its control and monitoring systems enable accuracy, consistency, and repeatability in the outcomes. Furthermore, its automated wafer preparation processes help streamline the entire material surface preparation process.
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