Used AMAT / APPLIED MATERIALS Mirra Ontrak #114141 for sale
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ID: 114141
Wafer Size: 8"
Vintage: 1999
CMP system, 8" flat
Components:
Main polisher module: Mirra 3400
Post cleaner module: Ontrack
Base box: cassette tub and box
Polisher cable cover
CMP 5201 controller
Operator desk:
(2) Monitors: FR 770, TW-LM-004
(2) Extensions
MPB700
(2) Multi power
Loader
(2) Cable boxes
Controller monitor desk
Specifications:
Wafer size: 8"
Wafer shape: flat
Application: Oxide
System: dry in / dry out
Process type: all
Device type: D-RAM
Device geometry: 0.09 microns
Consumed process material:
Polish slurry: STI
Buff slurry: none
Platen 1 pad: IC1010
Platen 2 pad: IC1010
Platen 3 pad: IC1010
Pad conditioner: snap on type
Pad conditioner head: modified DDF3 head
Pad conditioner holder: magnetic snap on / SAESOL
Factory interface options:
Cleaner type: Ontrack
Megasonics: no
Robot type: Ontrack side type
In situ removal rate monitor: digital
Inline metrology: none
SECS / GEM interface: yes, high-speed massage storage available
Cassette tank: yes
Cassette type: none
Installation type: through-the-wall
Integrated system basic FABS: FABS 212
Platen and head options:
Polishing head: (4) Titan I heads
Retaining rings: 4
Pad wafer loss sensor: yes
Platen temperature control: none
Slurry delivery options:
Slurry delivery: (3) slurries
Slurry flow rate: standard flow
Slurry flow monitor: yes
Slurry containment bulkhead: single containment
Slurry facilities: none
Slurry loop line: no
Slurry dispense arm: extended rinse arm
Slurry leak detector: no
DI water: yes
High pressure rinse: yes
System software:
Mirra type: Mirra Ontrack
Mirra software: N/A
Cleaner type: Ontrack
Cleaner software: N/A
Fabs type: standard
Fabs software: N/A
System safety equipment:
Red turn-to-release EMO button: standard
EMO guard ring: yes
Earthquake brackets: none
LO to disconnect polisher: N/A
Smoke detector: yes
Electrical requirements:
Line frequency: 50/60Hz
Line voltage: 200~230V
UPS battery: yes
Delta connection: yes
Power lamp: green
Power connected lamp: no
Circuit breaker: 230A
AC outlet box: 100V
Configurable I/O: no
Wide type GFI: 50mA
Umbilicals:
Polisher to controller cable: 75'
Controller to monitor cable: 75'
Slurry system interface cable: none
Factory hookup:
Upper exhaust: standard
Lower exhaust: none
Upper exhaust connection: 8"
Drain manifold: 4-line to facilities
Drain adapter: NPT fitting
Castors for Mirra system: no
Weight distribution plate (skid pad): yes
User interface:
Gray area: (1) monitor
Cleanroom: (1) monitor
Class 1 cart for 1 monitor: 1
Class 1 cart for 2 monitors: 0
Class 100 cart for 2 monitors: 0
Stainless carts: 1
PC mouse
Printer: none
Hard disk backup: no
Polisher / Fabs light tower:
Polisher tower mounting type: (4) lights
Polisher tower number of colors: (4) colors
Polisher tower colors sequence: RYGB
Cleaner options:
OnTrak cleaner: N/A
DNS cleaner: N/A
Mesa cleaner: yes
Manuals:
CD ROM: none
Standard paper manuals: none
Cleanroom paper manuals: none
Maintenance options:
Spray gun: single
Side panel window: none
Pad conditioner cover: none
Titan head rebuild kit: none
Consumables kit: none
Calibration box: none
Calibration box cable: none
English standard unit tool kit: none
Slurry flow calibration kit: none
Lapping stone: no
Robot door lock: N/A
Special options:
Nylon brush: no
EChain Teflon sheet: no
Low pressure release water: no
Spares:
Additional heads: 4
Warehoused
1999 vintage.
AMAT / APPLIED MATERIALS Mirra Ontrak is a wafer grinding, lapping and polishing equipment techno engineered to provide automation in semiconductor manufacturing processes. It enables high-precision, micro-precision grinding and polishing for production of silicon wafers for the semiconductor industry, providing wafer thinning, edge profiling, defect removal and surface finishing. The machine is designed to enable cost-efficient and consistent precision operation. It has a fully automated operation and is designed to be extremely fast, efficient and accurate. It has a high-resolution, feedback-controlled grinding system, allowing users to precisely regulate feed rate and speed. The grinding unit is provided with flexible setpoints that enable users to set a wide range of grinding parameters, such as surface roughness, depth of grinding and finish quality. The machine also has an automated wafer cleaning tool, providing multiple washing options and a variportioner-based lapping and etching asset. This model enables efficient and cost-effective production, providing consistent quality and repeatability. AMAT Mirra Ontrak is also equipped with a number of advanced features and accessories, such as a digital pressure controller and a touchgraph user interface. The pressure controller works to ensure that the grinding force is maintained in a range that allows for precise, safe and effective grinding operations. The touchgraph user interface is designed to provide an easy to understand overview of the grinding and polishing process, providing users with a comprehensive view of the entire process from start to finish. The equipment is also backed by AMAT global service and support network, providing the necessary support to keep production processes running smoothly and efficiently. Additionally, the system offers a wide range of customization options, allowing users to tailor the unit to their specific needs and requirements. Overall, APPLIED MATERIALS Mirra Ontrak provides efficient, cost-effective grinding and polishing services for production of semiconductor wafers. With its automated operation and advanced features, this machine is designed to provide users with repeatable results and consistent quality.
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