Used AMAT / APPLIED MATERIALS Mirra Ontrak #9064388 for sale

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ID: 9064388
Oxide CMP System, 8" 1999 vintage.
AMAT / APPLIED MATERIALS Mirra Ontrak is a wafer grinding, lapping, and polishing equipment designed for semiconductor fabrication and MEMS/NEMS production. The system employs a sophisticated mechanical design, advanced metrology technology, and a series of integrated process recipes to achieve nanometer-level surface topography. First, the unit consists of an automated platform that can accurately position the wafer between two rotating diamond grinding points in a controlled direction. This enables precise wafer grinding and the lapping process to be completed in parallel. The machine also provides a polishing operation that involves a chemical mechanical planarization (CMP) process necessitating different polishing motion paths and sequences. The tool also features a high-resolution programmable robotics asset, which can quickly and automatically identify and measure the exact surface features of the wafer and determine the accuracy of the resultant topography. This ensures that the grinding and polishing processes been applied with precision. The model includes a vacuum chamber with a special wafer cooling mechanism to ensure optimal wafer temperature and reduce contaminants or particles from attaching to the surface. The vacuum chamber also enables ultra-high planarization of the wafer's surface during the polishing process. Finally, a pixel array camera equipment is installed to accurately measure the wafer's surface features and the uniformity across the wafer's surface. This improves process control, allowing the user to quickly adjust the process parameters if necessary. Overall, AMAT Mirra Ontrak system provides a consistent, reliable, and repeatable set of wafer grinding, lapping and polishing processes, essential for the fabrication of advanced semiconductor and MEMS/NEMS devices. Its highly automated, multifaceted design makes it both user and cost-effective, while still achieving a high-quality surface finish.
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