Used AMAT / APPLIED MATERIALS Mirra Ontrak #9228447 for sale

AMAT / APPLIED MATERIALS Mirra Ontrak Wafer Grinding, Lapping & Polishing Equipment is an automated process for performing wafer fabrication quickly and accurately. The system uses two grinding heads that operate in tandem to shape, contour and smooth the surface of a given wafer, preparing it for further steps in the manufacturing and production process. AMAT Mirra Ontrak has a pair of grinding heads in a V-shaped configuration. The grinding heads move in a synchronized pattern along the circumference of the wafer in order to create a uniform and high-quality surface finish. The unit also includes an adjustable grinding pressure that can be adjusted to conform to the rigid requirements of a semiconductor wafer. The precision of APPLIED MATERIALS Mirra Ontrak machine is maintained thanks to its advanced servo-controlled movement and its use of a grinding disc made of diamond which allows for a high degree of accuracy. Additionally, the tool is equipped with an onboard vision-guided inspection asset to check for scratches, inconsistencies, and other imperfections in the surface of the wafer. This ensures that the wafer is of the highest accuracy and quality before being sent to the next process. Mirra Ontrak model is also outfitted with a pressure control equipment to ensure a consistent and even grind and pressure. This feature ensures that the wafer does not become damaged during the entire process. The system also includes various safety features in order to protect both the wafer and the operator. It includes an emergency shutdown in cases of unit failure, as well as an interlock machine to prevent the operators from entering the tool while it is in operation. In summary, AMAT / APPLIED MATERIALS Mirra Ontrak Wafer Grinding, Lapping & Polishing Asset is a state-of-the-art model used to quickly and accurately grind, lap, and polish wafers. It features a pair of grinding heads in V-shaped configuration and is capable of producing a high degree of accuracy while maintaining a consistent and even pressure throughout the entire process. Its integrated inspection equipment is capable of checking for scratches, inconsistencies, and other imperfections before the wafer is sent for further processing. Finally, the system also comes with a variety of safety features to ensure the safety of both the wafer and the operator.