Used AMAT / APPLIED MATERIALS Mirra Ontrak #9250631 for sale

AMAT / APPLIED MATERIALS Mirra Ontrak is a versatile machine designed for high-precision automated wafer grinding, lapping, and polishing. It comes with a patent-pending Automated Tooling Equipment (AATS) that enables it to switch between grinding, lapping, and polishing operations quickly and precisely. A unique feature of AMAT Mirra Ontrak is its highly accurate force control system for precise modulated force that allows for optimal polishing results. Through this unit, APPLIED MATERIALS Mirra Ontrak is able to reliably and accurately process a variety of materials for use in critical semiconductor applications. Mirra Ontrak features a high precision three-axis motion platform that is capable of traveling up to 4200mm/s, along with a rigid granite construction to ensure accurate and stable tool motions. It is also equipped with two independent temperature-controlled LM10 Force Control Machine motors providing unified forces up to 400N. Additionally, the tool supports active/passive grinding modes and is capable of achieving both fine and coarse processing. AMAT / APPLIED MATERIALS Mirra Ontrak provides an intelligent asset to measure and precisely control not only force, but also the grinding speed, acceleration, and deceleration to optimize the process for each substrate. It also features a direct process control model that enables it to switch between processing modes quickly and accurately throughout a single process. This ensures that each process is done according to the exact requirements of the application. Furthermore, AMAT Mirra Ontrak is equipped with various environmental control systems, such as temperature and humidity sensors, that monitor the machine's environment to ensure the process is not disrupted. It also has a number of safety features to protect the user and the equipment to ensure the highest performance and reliability. In conclusion, APPLIED MATERIALS Mirra Ontrak is a rugged and reliable tool designed specifically for high-precision grinding, lapping, and polishing that is capable of processing a variety of materials with its Active/Passive grinding modes, high-speed motions, and intelligent force control system. It is a reliable and accurate tool that is ideal for any semiconductor application.