Used AMAT / APPLIED MATERIALS Mirra Titan II #9049233 for sale

AMAT / APPLIED MATERIALS Mirra Titan II is a wafer grinding, lapping and polishing equipment used for grinding and polishing the surfaces of semiconductor wafers. This system uses a variety of grinding and polishing techniques to create an even, smooth, and high-quality finish on the wafer surfaces. AMAT Mirra Titan II is designed to reduce cycle times and improve yields, as well as provide high-precision lapping and polishing of the wafer walls and top surfaces. The unit utilizes a patented 'smart move' technology, which ensures that every move is precisely calculated, leaving no room for error. This means that the machine can grind and polish quickly, and with great accuracy. Additionally, the tool utilizes a high-tech vacuum asset that can effectively control the grinding and polishing process, reducing contamination. The model's polishing procedure is divided into three steps. First, the wafers are prepped, which includes gradual grinding to the desired size. Then there is the lapping process, which works by applying a slurry of abrasive and de-ionized water to the wafers. This is followed by a series of high-speed buffing discs that will further smooth the surfaces. Lastly, the systems polishing step utilizes a polishing pad that is loaded with a polishing compound designed to finish the job. APPLIED MATERIALS Mirra Titan II is designed to grind and polish a variety of different size wafers ranging from large to small. Additionally, the equipment comes with a variety of different sized polishing pads that are designed to ensure the best possible finish on each wafer. This combination of grinding and polishing tools ensures that the wafer's surface is left smooth and consistent, with minimal defects, resulting in an even and high-quality finish. The system also provides users with the ability to monitor and control the parameters of the process in order to ensure consistent performance and repeatable results. The unit also has built-in data logging and process analysis capabilities, allowing users to review the data and optimize the process to ensure the best possible outcomes. Overall, Mirra Titan II is a reliable and efficient wafer grinding, lapping and polishing machine designed to reduce cycle times and improve yields while providing a high-precision finish on the wafers being processed. This tool's advanced technology and patented 'smart move' technology ensure that each move is precisely calculated, resulting in a fast, error-free process and high-quality finished product.