Used AMAT / APPLIED MATERIALS Mirra OnTrak #9223507 for sale
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ID: 9223507
Wafer Size: 8"
Vintage: 2000
CMP System, 8"
System controller
Main system:
Polisher
Ontrak cleaner
FABS Cassette system
CPU: Pentium III 400 MHz
Dual RAID hard disk
Hard disk size: 68 GB
RAM: 128 MB
Hardware:
Polisher with controller: Mirra 3400 / 5201
Cleaner: Ontrak
Indexer: RORZE FABS
Slurry (P1+P2+P3): AB
Endpoint laser P2: Legacy non FS
Polisher middle skins: Clear middle skin
No chiller
Com port server: Digi EL160
Cleaner brush LDM: LDM With entegris flow sensors
Slurry in CLC
Slurry arm: (2) Lines
Polishing head: Titan I
Rotary union: (3) Ports
Cross type: Cattrack
Cassette slot run order (From slot 1 down to 25)
Consumable:
Platen teflon coated
Pad conditioner type: UNIVERSAL
Retainer ring type: AEP II
Membrane type: Silicone membrane
PC Diaphragm: DDF3 Diaphragm
Brush with core type: Aion ontrak brush has been replaced
Upgrade / CIP Retrofit details:
LLA Guide pin: Self align
UPA: Waterfall
No splash guard
Exhaust blower
Magnehelic pressure low level detection kit
SRD Exhaust interlock
Queue tub
No blackout covers
2000 vintage.
AMAT / APPLIED MATERIALS Mirra Track Wafer Grinding, Lapping and Polishing Equipment is a turnkey solution for high-precision, low-cost processing of semiconductor wafers. A robust and compact system, it performs front-side and back-side single-side grinding, lapping, and polishing with the highest accuracy available. One of its core features is a quick changeover capability which allows for wafer size range and lapping thicknesses to be changed quickly. It is used for a variety of semiconductor applications, such as mirror and flat wafer lapping, die separator and bevel grinding, and patterned film polishing. Furthermore, it employs a unique two-station processing method, which increases throughput and reduces overall cost and time-to-market. The unit's grinding and lapping uses a combination of the most advanced abrasive technology, diamond dust and ceramic wheel systems. This enables high-accuracy grinding, lapping, and polishing, to within that nanometer range. Furthermore, the modularized design includes a lapping and grinding station, as well as a cleaning, polishing, and inspection station, to ensure each wafer is of the highest precision. The machine has a software, Advanced Processing Technology (APT), to provide a user friendly interface to manage the lapping and grinding process. The software contains program controls for wafer size range, lapping thickness monitor, feedback control systems, lapping tape loading profiles, grinding parameters, polish parameters (pressure, time), and polishing cycle to further ensure accuracy and precision. Overall, AMAT Mirra Track Wafer Grinding, Lapping and Polishing Tool offers an advanced and robust solution for semiconductor manufacturers with low-cost and high-accuracy processing capabilities. Its unique two-stage processing and quick changeover feature enables the systems to process a variety of semiconductor applications with the highest precision. With its Advanced Processing Technology software, it offers further precision and control of the process.
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