Used AMAT / APPLIED MATERIALS Mirra Track #9223509 for sale

ID: 9223509
Wafer Size: 8"
Vintage: 2000
CMP System, 8" Process: PCUD System controller Main system: Polisher Ontrak cleaner FABS Cassette system Missing / Faulty parts: Pneutronic board (2) Slip rings Analog board Cross motor CPU: Pentium III 400 MHz Dual RAID hard disk Hard disk size: 68 GB RAM: 128 MB Hardware: Polisher with controller: Mirra 3400 / 5201 Cleaner: Ontrak Indexer: RORZE FABS Slurry (P1+P2+P3): AB Endpoint laser P1: IScan Endpoint laser P2: FullScan Polisher middle skins: P1 & P3 Dark skin, P2 clear skin No chiller Com port server: Digi EL160 Cleaner brush LDM: LDM With entegris flow sensors Slurry in CLC Slurry arm: (4) Lines Polishing head: Titan I Rotary union: (3) Ports Cross type: Cattrack Cassette slot run order (From slot 1 down to 25) Platen teflon coated Pad conditioner type: UNIVERSAL Retainer ring type: AEP II Membrane type: Silicone membrane PC Diaphragm: DDF3 Diaphragm Brush with core type: MYKROLIS Ontrak brush Upgrade / CIP Retrofit details: LLA Guide pin: Self align PM Reduction kit: Partial UPA: Waterfall No splash guard Exhaust blower Magnehelic pressure low level detection kit SRD Exhaust interlock Queue tub Blackout covers 2000 vintage.
AMAT / APPLIED MATERIALS Mirra Track is a wafer grinding, lapping and polishing equipment designed for the semiconductor and related industries. This system is designed to provide superior surface flatness and surface defect reduction at high production speeds. The versatility of this unit enables it to handle multiple wafer configurations and sizes. The main components of AMAT Mirra Track include a multi-blade coated wafer carrier, a keyless ring clamp, a keyless, multi-port alignment machine, and a surface flatness metrology tool. The coated wafer carrier is designed to hold multiple wafers securely and in the correct orientation to ensure maximum flatness and defect reduction. The keyless ring clamp ensures proper wafer mounting and swing. The multi-port alignment asset allows for both manual and automated alignment of the wafer singularly or in a batch, while the surface flatness metrology model allows for direct surface flatness measurement. The equipment is capable of grinding, lapping and polishing wafers with a range of up to 25mm. This can be achieved through the use of different grit sizes and polishing pads, allowing for a wide range of process recipes to be used. The system can also be programmed for fully automated, closed loop operation with direct user control over the process recipe and parameters. This allows users to customize the wafer processing steps to the specific application. APPLIED MATERIALS Mirra Track is designed with a high level of data-tracking capabilities, including event logging, process data storage, and remote software diagnostics. These features enable users to monitor wafer process quality and adjust parameters on the fly to maintain a high level of quality control. Overall, Mirra Track is a versatile unit that can be used for a number of different applications. Its advanced features and capability to customize the wafer processing steps make it a valuable asset in the semiconductor and related industries.
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