Used AMAT / APPLIED MATERIALS Mirra Track #9223509 for sale
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ID: 9223509
Wafer Size: 8"
Vintage: 2000
CMP System, 8"
Process: PCUD
System controller
Main system:
Polisher
Ontrak cleaner
FABS Cassette system
Missing / Faulty parts:
Pneutronic board
(2) Slip rings
Analog board
Cross motor
CPU: Pentium III 400 MHz
Dual RAID hard disk
Hard disk size: 68 GB
RAM: 128 MB
Hardware:
Polisher with controller: Mirra 3400 / 5201
Cleaner: Ontrak
Indexer: RORZE FABS
Slurry (P1+P2+P3): AB
Endpoint laser P1: IScan
Endpoint laser P2: FullScan
Polisher middle skins: P1 & P3 Dark skin, P2 clear skin
No chiller
Com port server: Digi EL160
Cleaner brush LDM: LDM With entegris flow sensors
Slurry in CLC
Slurry arm: (4) Lines
Polishing head: Titan I
Rotary union: (3) Ports
Cross type: Cattrack
Cassette slot run order (From slot 1 down to 25)
Platen teflon coated
Pad conditioner type: UNIVERSAL
Retainer ring type: AEP II
Membrane type: Silicone membrane
PC Diaphragm: DDF3 Diaphragm
Brush with core type: MYKROLIS Ontrak brush
Upgrade / CIP Retrofit details:
LLA Guide pin: Self align
PM Reduction kit: Partial
UPA: Waterfall
No splash guard
Exhaust blower
Magnehelic pressure low level detection kit
SRD Exhaust interlock
Queue tub
Blackout covers
2000 vintage.
AMAT / APPLIED MATERIALS Mirra Track is a wafer grinding, lapping and polishing equipment designed for the semiconductor and related industries. This system is designed to provide superior surface flatness and surface defect reduction at high production speeds. The versatility of this unit enables it to handle multiple wafer configurations and sizes. The main components of AMAT Mirra Track include a multi-blade coated wafer carrier, a keyless ring clamp, a keyless, multi-port alignment machine, and a surface flatness metrology tool. The coated wafer carrier is designed to hold multiple wafers securely and in the correct orientation to ensure maximum flatness and defect reduction. The keyless ring clamp ensures proper wafer mounting and swing. The multi-port alignment asset allows for both manual and automated alignment of the wafer singularly or in a batch, while the surface flatness metrology model allows for direct surface flatness measurement. The equipment is capable of grinding, lapping and polishing wafers with a range of up to 25mm. This can be achieved through the use of different grit sizes and polishing pads, allowing for a wide range of process recipes to be used. The system can also be programmed for fully automated, closed loop operation with direct user control over the process recipe and parameters. This allows users to customize the wafer processing steps to the specific application. APPLIED MATERIALS Mirra Track is designed with a high level of data-tracking capabilities, including event logging, process data storage, and remote software diagnostics. These features enable users to monitor wafer process quality and adjust parameters on the fly to maintain a high level of quality control. Overall, Mirra Track is a versatile unit that can be used for a number of different applications. Its advanced features and capability to customize the wafer processing steps make it a valuable asset in the semiconductor and related industries.
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