Used AMAT / APPLIED MATERIALS Mirra #9142634 for sale

AMAT / APPLIED MATERIALS Mirra
ID: 9142634
Wafer Size: 8"
Vintage: 2000
CMP Oxide systems, 8" 2000 vintage.
AMAT / APPLIED MATERIALS Mirra is a wafer grinding, lapping and polishing equipment developed for the efficient processing of wafer substrates. This system is used to remove surface imperfections from the wafer surface to create a more durable and defect-free surface. The unit features a high quality spindle motor which is used to drive the grinding and polishing processes of the substrate material. It also includes an integrated air-cooled oven which helps to evenly heat the wafer surface, enabling the maximum amount of polishing abrasives to be used while preventing thermal damage. The machine consists of a high-precision wafer chuck and a powered distribution head to ensure repeatable and consistent loading and grinding of the wafer surfaces. AMAT Mirra also features precise and reliable vacuum wafer clamping, enabling faster grinding, lapping, and polishing of wafers. A unique, patented process ensures that the highest quality wafer surfaces can be produced in the shortest time possible. This process combines a multi-step grinding process using diamond dust and a kinematic grinding head to deliver superior results. The tool also features a fully automated grinding asset to facilitate efficient operations. The model features a 5-axis robotic platform for automated grinding, lapping, and polishing of the wafers. This helps to reduce the time needed for manual handling of wafers, allowing for shorter processing times and higher productivity. The equipment has been designed with the latest process and control technology to ensure the highest quality wafer surfaces. This includes an integrated loop controller for process control, as well as an advanced recipe management system to ensure repeatability and consistency. In conclusion, APPLIED MATERIALS Mirra is a wafer grinding, lapping and polishing unit designed for efficient and high quality processing. The machine features a high quality spindle motor, oven, wafer chuck, distribution head, and vacuum wafer clamping. It also utilizes a multi-step grinding process and a 5-axis robotic platform for automated handling. Lastly, the tool also includes an integrated loop controller and advanced recipe management asset to ensure repeatability and consistency.
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