Used AMAT / APPLIED MATERIALS Mirra #9233892 for sale

AMAT / APPLIED MATERIALS Mirra Wafer Grinding, Lapping, and Polishing equipment is an advanced bonding solution for wafer fabrication. This system is an ideal solution for the production of semiconductor wafers, as it facilitates the processing and finishing of standard and custom sizes with a high level of flexibility. AMAT Mirra unit is designed for wafer grinding, lapping, and polishing operations in a single, compact platform. The machine includes an integrated high-precision robot, high-resolution piezo stages, DLPR technology, and powerful software that enables automated process control. It is capable of producing high-precision wafers with consistent thickness, superior surface finish, and reduced residual stress. APPLIED MATERIALS Mirra is equipped with electrostatic clamping technology to securely hold thin wafers. This efficient clamping tool reduces contamination and delivers reliable results. The integrated high-precision robot speeds up the production process and provides superior stability and accuracy. The DLPR technology ensures process uniformity and repeatability while the integrated software enables automated control of the grinding, lapping, and polishing workflows. Mirra is equipped with a special grinding, lapping, and polishing spindle and a modular chuck. The spindle and chuck work together to precisely grind, lap, and polish wafers in a single process cycle, significantly reducing cycle time and cost. Additionally, the asset includes a fill monitoring model to control process parameters and maintain product consistency. AMAT / APPLIED MATERIALS Mirra is a highly versatile equipment, with customers reporting conserving up to 80% of the production time compared to other wafer solutions. It also reduces grinding waste and offers lower production costs compared to other solutions. The systems features an intuitive, user-friendly interface, allowing for easy operation and swift changeovers. In conclusion, AMAT Mirra Wafer Grinding, Lapping, and Polishing System is an ideal solution for wafer fabrication. It offers high precision, superior surface finish, and increased efficiency. Its advanced robotic technology, specialized spindle and chuck, and automated process control optimize yields while reducing cycle times. Ultimately, APPLIED MATERIALS Mirra Wafer Grinding, Lapping, and Polishing Unit delivers a higher quality product at a lower production cost.