Used AMAT / APPLIED MATERIALS Mirra #9235104 for sale

AMAT / APPLIED MATERIALS Mirra is an automated wafer grinding, lapping and polishing equipment used in semiconductor manufacturing and advanced materials production. The system utilizes precisely controlled robotic manipulators that can grind, lap, and polish high-precision wafers from any material. The unit's features allow for improved throughput, higher yields, and lower costs. The machine is designed to quickly and accurately process wafers from substrate manufacturing materials such as silicon and other semiconductors, diamond, glass, ceramics, and other advanced materials. The tool utilizes two independent robotic manipulators - one for grinding and lapping, and the other for polishing. Each manipulator employs multiple tweezing heads to precisely conduct the grinding and polishing tasks and to produce the desired surface finish on the wafers. The asset offers precise control over grinding speeds, lap pressures, and polishing forces. It is also capable of in-process monitoring of the surface-finish specimen to allow for real-time corrective action if needed. Using its closed-loop control model, AMAT Mirra is able to provide accurate and repeatable output. APPLIED MATERIALS Mirra also offers a high level of flexibility. Its robotic manipulators can be used to perform a variety of grinding and polishing operations (Figure 1). It can handle grinding/lapping of diameters up to 500mm and is suitable for applications including wafer pre-cleaning and wafer damage repair. The polishing heads can reach down to the center of the wafer, allowing for optimal control of the polishing process. The equipment also offers engineers the ability to adjust the aggressiveness of the polishing process depending on the surface quality desired. In addition, the system has several safety features available to ensure operator safety. The unit also includes safety panels with a voice prompted audible warning machine. This prevents accidental contact with exposed areas, and provides a visual warning of any process errors. Mirra helps reduce process times, improve yields, and decrease production costs, making it an ideal choice for grinding, lapping, and polishing wafers. It is designed to meet the demanding requirements of today's advanced materials production and semiconductor processes.