Used AMAT / APPLIED MATERIALS Mirra #9256808 for sale

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ID: 9256808
Wafer Size: 8"
CMP System, parts machine, 8" SECS / GEM Main frame Delivery slurry arm and pump Transfer cross base Polish upper platen Polish platen gear box System controller: Backside PCB board Controller down force: AB Board Inter platen Clean cup Breakers Monitor Damaged parts: (3) Lower platens (12) Cover scraps (6) I/O and interlock boards (3) Platen drivers and motors (4) UPA Rotations (4) NSK Motors (4) Spindles (12) UPA Regulators (6) MEI Boards (6) CPU Boards (6) PC Assembly retrofit ML (4) Heads HCLU Fabs relative part Cables DIW Mainfold retrofit ML DC Power supply Wet robot.
AMAT / APPLIED MATERIALS Mirra is a wafer grinding, lapping and polishing equipment designed to offer the highest levels of precision, accuracy and uniformity during the wafer processing cycle. The system can accommodate substrates ranging in size from 300mm to 150mm and handle virtually any type of material. It features an advanced, automated motion unit that is designed to reduce substrate and process variability while increasing throughput. AMAT Mirra machine is equipped with a precision wafer polishing head, which reduces potential polishing abrasives variability and provides consistent polishing results regardless of substrate orientation. The tool is also outfitted with a closed loop pressure and speed control asset. This feature helps eliminate the possibility of substrate and process variability while providing uniform polishing results. The model's advanced motion control platform is designed to precisely maneuver the wafer carrier over the polishing pad, allowing for optimal process control. APPLIED MATERIALS Mirra equipment can be used to process multiple film type layers including silicone, SiN, and SiO2. The system features a patented independent wafer carrier unit, which enables multiple simultaneous processing cycles. This feature eliminates the need for the manual wage handling and drastically reduces downtime. Mirra machine can also be used to perform edge rounding, dicing, grinding, and thinning operations. All operations are achieved with precision and accuracy via the tool's advanced control components. AMAT / APPLIED MATERIALS Mirra's fully automated asset eliminates the need for manual labor and allows for higher levels of efficiency and productivity. Additionally, the model features an intuitive graphical user interface that simplifies the setup and use of the equipment. The interface allows users to monitor the system and make necessary adjustments throughout the processing cycle. Safety features such as the zone and speed control unit also provide additional protection and reassure operators are working in a safe and secure environment. Overall, AMAT Mirra machine is a powerful, reliable, and efficient wafer processing tool. As a comprehensive, all-in-one asset, it offers users the ability to produce components with highly accurate and uniform results with little to no manual labor required. Its intuitive graphical user interface and speed control features provide additional peace of mind and safety. With APPLIED MATERIALS Mirra model, users can take advantage of a simple and straightforward way to achieve high levels of precision and accuracy in the wafer processing cycle.
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