Used AMAT / APPLIED MATERIALS Mirra #9264177 for sale

AMAT / APPLIED MATERIALS Mirra Wafer Grinding, Lapping and Polishing Equipment is a dedicated workhorse designed specifically for the semiconductor fabrication process. The machine features an integrated and user-friendly control system, its advanced microstructure design offers excellent polishing, lapping and grinding results, and its state-of-the-art designs provide superior poatching repeatability and surface finish. AMAT Mirra incorporates a range of polishing tools specifically designed for each application. These tools effectively grind and polish semiconductor substrates, and can operate on a variety of materials including silicon oxide, gallium nitride and related materials. The machine is capable of producing extremely flat surface finishes, ensuring that the substrates are nearly perfectly planar. It features a horizontal plane table to ensure consistent surface finish and the flexibility to accommodate different substrate sizes. Its multiple flatness correction sensors measure the flatness of a surface during grinding, allowing for precise flatness control and repeatability. The automated unit can be programmed to ensure repetitive grinding, lapping and polishing processes with the same results. Its advanced automation delivers significant process yield improvements. APPLIED MATERIALS Mirra contains an Advanced Process Control Machine which provides precise control of the machine parameters and monitors the temperature, pressure and material removal rates during the process. The automated tool cuts process times by more than 50% and helps to reduce material costs. The asset also provides real-time process monitoring, allowing for process optimization and reduced waste. The machine's CnC controller allows for precise part positioning and repeatability. Its integrated CCD model ensures precise measurement and ease of measurement. The equipment also offers automatic edge detection, which allows for unmatched positioning accuracy. Additional features include an advanced CnC system, precision tool holders and a touch-screen user interface. Mirra provides cutting-edge precision and repeatability in its grinding, lapping and polishing operations. With its state-of-the-art technologies and advanced process control unit, it ensures superior quality and surface finish of substrates for semiconductor fabrication processes.