Used AMAT / APPLIED MATERIALS Mirra #9273592 for sale

AMAT / APPLIED MATERIALS Mirra
ID: 9273592
CMP System.
AMAT / APPLIED MATERIALS Mirra is a wafer grinding, lapping and polishing equipment used in advanced semiconductor manufacturing processes. It is an automation platform that can be configured to accommodate large diameter wafer markets such as semiconductors, MEMs and opto-electronics. This system is designed for complex processes and provides precise and high-level accuracy. It features a compact platform that is designed to maximize throughput and production while minimizing thermal expansion and maintenance time. AMAT Mirra unit includes an advanced wafer-handling machine with multiple wafer configurations. The machine also features a high-torque multi-axis spindle drive and a high accuracy CNC positioning tool with an encoder for repeatable part positioning. Additionally, the asset includes a number of integrated processes such as grinding, lapping and polishing. The grinding, lapping and polishing processes are precisely tailored to the customer's application in order to achieve the highest level of performance. The spindle drive is designed to support a wide range of grinding wheels and lapping and polishing tools. The unique combination of the spindle drive, high-pressure air flow, advanced CNC control and high accuracy encoders ensure the highest levels of accuracy. APPLIED MATERIALS Mirra also includes a robust vision model that provides detailed information of the wafer surface to ensure repeatable and accurate polishing results. The equipment can also be interfaced with a host of different data management systems for quick and easy documentation of results. The system also offers a range of safety features that guard against operator fatigue and errors. Overall, Mirra provides precise and accurate wafer grinding, lapping and polishing performance, making it an ideal choice for advanced and demanding semiconductor manufacturing processes. The unit features a compact platform, a high-torque multi-axis spindle, advanced vision systems, and a range of integrated processes that ensure the highest level of accuracy and repeatability.
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