Used AMAT / APPLIED MATERIALS Mirra #9293685 for sale

AMAT / APPLIED MATERIALS Mirra is a wafer grinding, lapping and polishing equipment specifically designed for semiconductor applications. AMAT Mirra is capable of achieving ultra-precise surface finishes and accurate shape control on substrates for R&D and production purposes. APPLIED MATERIALS Mirra is equipped with an advanced wet grinding and polishing process which reduces the need for post-polishing by producing a superior surface finish that is optimized for gate oxide growth in CMP processes. The unique "wall plug" grind control system is designed to reduce substrate slippage during grinding, resulting in higher uniformity and improved wafer flatness. Mirra also includes a high compliance, low load mechanized wafer chucking unit that is designed to improve step height control. This machine helps to reduce the necessity for additional lapping processes and also minimizes the potential for particle and surface scratching. The tool also includes a robotic wafer handling asset for transferring wafers between process stations. This improves operator safety and enables accurate tracking of production and process data. The model also incorporates advanced in-situ scrubbing and rinsing processes for a high-level of contamination control and automated maintenance routines for extended working life. AMAT / APPLIED MATERIALS Mirra has been designed to meet the stringent process requirements of semiconductor, MEMS and thin film device manufacturing. It offers high levels of process repeatability, a wide process temperature range and integrated process monitoring capabilities. The equipment is also designed to promote efficient and safe operation, with a low 300mm footprint which allows it to fit easily into a factory automation environment. AMAT Mirra is also equipped with a multi-language operator interface, intuitive system navigation and an easy-to-use graphical process recipe creator. In summary, APPLIED MATERIALS Mirra is an advanced wafer grinding, lapping and polishing unit that is designed to meet the stringent requirements of semiconductor, MEMS and thin film device manufacturing. Its unique features, such as wall plug grind control, mechanized wafer chucking, robotic wafer handling, advanced scrubbing and rinsing processes, and automated maintenance routines help to deliver accurate and uniform results over a wide temperature range.